Hisashi Arai

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Akiruno, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding method and apparatus
- Patent number 7,087,457
- Issue date Aug 8, 2006
- Kabushiki Kaisha Shinkawa
- Yoshiyuki Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 6,070,780
- Issue date Jun 6, 2000
- Kabushiki Kaisha Shinkawa
- Masayuki Shimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire height inspection device
- Patent number 6,059,846
- Issue date May 9, 2000
- Kabushiki Kaisha Shinkawa
- Hisashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating device for a bonding apparatus
- Patent number 5,651,492
- Issue date Jul 29, 1997
- Kabushiki Kaisha Shinkawa
- Hisashi Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Die bonding method and apparatus
- Publication number 20040157368
- Publication date Aug 12, 2004
- KABUSHIKI KAISHA SHINKAWA
- Yoshiyuki Ogata
- H01 - BASIC ELECTRIC ELEMENTS