TREA

Hisashi Arakida

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Cutting apparatus
    • Patent number 10,950,451
    • Issue date Mar 16, 2021
    • Disco Corporation
    • Hisashi Arakida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,629,445
    • Issue date Apr 21, 2020
    • Disco Corporation
    • Katsuhiko Suzuki
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20190295850
    • Publication date Sep 26, 2019
    • Disco Corporation
    • Hisashi ARAKIDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190006185
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Katsuhiko Suzuki
    • H01 - BASIC ELECTRIC ELEMENTS