Hisashi Funakoshi

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a lead clamping arrangement
- Patent number 5,998,866
- Issue date Dec 7, 1999
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 5,776,802
- Issue date Jul 7, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method of mounting semiconductor chip
- Patent number 5,708,293
- Issue date Jan 13, 1998
- Matsushita Electronics Corporation
- Takao Ochi
- H01 - BASIC ELECTRIC ELEMENTS