Hisashi Kaneko

Person

Fujisawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 8,456,186
- Issue date Jun 4, 2013
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device from which damage la...
- Patent number 8,232,197
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating pattern, method for manufacturing semiconduct...
- Patent number 7,996,813
- Issue date Aug 9, 2011
- Kabushiki Kaisha Toshiba
- Masaaki Hatano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stress analysis method, wiring structure design method, program, an...
- Patent number 7,921,401
- Issue date Apr 5, 2011
- Kabushiki Kaisha Toshiba
- Sachiyo Ito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating pattern, method for manufacturing semiconduct...
- Patent number 7,667,332
- Issue date Feb 23, 2010
- Kabushiki Kaisha Toshiba
- Masaaki Hatano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,635,646
- Issue date Dec 22, 2009
- Kabushiki Kaisha Toshiba
- Seiichi Omoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,608,537
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device from which damage la...
- Patent number 7,605,076
- Issue date Oct 20, 2009
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect metallization method having thermally treated copper p...
- Patent number 7,601,638
- Issue date Oct 13, 2009
- Kabushiki Kaisha Toshiba
- Masahiko Hasunuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method
- Patent number 7,575,664
- Issue date Aug 18, 2009
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 7,531,876
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,521,352
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Hideo Shinomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing electrolytic treatment on a conductive layer o...
- Patent number 7,387,717
- Issue date Jun 17, 2008
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,314,827
- Issue date Jan 1, 2008
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Simulation circuit pattern evaluation method, manufacturing method...
- Patent number 7,308,395
- Issue date Dec 11, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 7,242,206
- Issue date Jul 10, 2007
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Heating element movement bonding method for semiconductor components
- Patent number 7,238,919
- Issue date Jul 3, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,232,763
- Issue date Jun 19, 2007
- Kabushiki Kaisha Toshiba
- Mitsuhiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 7,214,305
- Issue date May 8, 2007
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing semiconductor device
- Patent number 7,202,168
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Hiroshi Ikenoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 7,091,733
- Issue date Aug 15, 2006
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device manufacturing method
- Patent number 6,998,342
- Issue date Feb 14, 2006
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,946,387
- Issue date Sep 20, 2005
- Kabushiki Kaisha Toshiba
- Junichi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 6,913,681
- Issue date Jul 5, 2005
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device including two-step pol...
- Patent number 6,897,143
- Issue date May 24, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having multilevel interconn...
- Patent number 6,774,024
- Issue date Aug 10, 2004
- Kabushiki Kaisha Toshiba
- Koji Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 6,767,437
- Issue date Jul 27, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device manufacturing method
- Patent number 6,764,585
- Issue date Jul 20, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and plating apparatus
- Patent number 6,746,589
- Issue date Jun 8, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for generating pattern, method for manufacturing semiconduct...
- Publication number 20100115479
- Publication date May 6, 2010
- Kabushiki Kaisha Toshiba
- Masaaki Hatano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of manufacturing a semiconductor device from which damage la...
- Publication number 20100003816
- Publication date Jan 7, 2010
- Kabushiki Kaisha Toshiba
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APP...
- Publication number 20090156002
- Publication date Jun 18, 2009
- Keiji Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20080299766
- Publication date Dec 4, 2008
- Seiichi OMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20080296165
- Publication date Dec 4, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080251385
- Publication date Oct 16, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080102628
- Publication date May 1, 2008
- Masahiko Hasunuma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Fabricating Semiconductor Device
- Publication number 20080081466
- Publication date Apr 3, 2008
- Mie MATSUO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST...
- Publication number 20080018355
- Publication date Jan 24, 2008
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20070254474
- Publication date Nov 1, 2007
- Hideo Shinomiya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Stress analysis method, wiring structure design method, program, an...
- Publication number 20070204243
- Publication date Aug 30, 2007
- Sachiyo Ito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20060207985
- Publication date Sep 21, 2006
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a semiconductor device from which damage la...
- Publication number 20060189145
- Publication date Aug 24, 2006
- Makoto Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate, holding method of thin wafer, and manufacturin...
- Publication number 20060102290
- Publication date May 18, 2006
- Susumu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for generating pattern, method for manufacturing semiconduct...
- Publication number 20060097399
- Publication date May 11, 2006
- Masaaki Hatano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060071271
- Publication date Apr 6, 2006
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060068600
- Publication date Mar 30, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060055050
- Publication date Mar 16, 2006
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing semiconductor device
- Publication number 20060024952
- Publication date Feb 2, 2006
- Hiroshi Ikenoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability evaluation test apparatus, reliability evaluation test...
- Publication number 20050253575
- Publication date Nov 17, 2005
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Application
Substrate processing apparatus and substrate processing method
- Publication number 20050241955
- Publication date Nov 3, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method
- Publication number 20050211560
- Publication date Sep 29, 2005
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050106866
- Publication date May 19, 2005
- Mitsuhiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simulation circuit pattern evaluation method, manufacturing method...
- Publication number 20050075854
- Publication date Apr 7, 2005
- Hisashi Kaneko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040251550
- Publication date Dec 16, 2004
- Takashi Yoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device having multilevel interconn...
- Publication number 20040245645
- Publication date Dec 9, 2004
- Koji Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing electronic device
- Publication number 20040226827
- Publication date Nov 18, 2004
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic device manufacturing method
- Publication number 20040203221
- Publication date Oct 14, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Hisashi Kaneko

Person

Patents Grantslast 30 patents

Reliability evaluation test apparatus, reliability evaluation test...

Method of manufacturing a semiconductor device from which damage la...

Method for generating pattern, method for manufacturing semiconduct...

Stress analysis method, wiring structure design method, program, an...

Semiconductor device including an insulating film and insulating pi...

Method for generating pattern, method for manufacturing semiconduct...

Method for fabricating semiconductor device

Method for fabricating semiconductor device

Method of manufacturing a semiconductor device from which damage la...

Interconnect metallization method having thermally treated copper p...

Plating method

Semiconductor device having power semiconductor elements

Method for manufacturing a semiconductor device

Method of performing electrolytic treatment on a conductive layer o...

Method of manufacturing semiconductor device

Simulation circuit pattern evaluation method, manufacturing method...

Reliability evaluation test apparatus, reliability evaluation test...

Heating element movement bonding method for semiconductor components

Method of manufacturing semiconductor device

Method of manufacturing electronic device

Method of producing semiconductor device

Reliability evaluation test apparatus, reliability evaluation test...

Electronic device manufacturing method

Semiconductor device and method for manufacturing the same

Plating method and plating apparatus

Method of manufacturing semiconductor device including two-step pol...

Semiconductor integrated circuit device having multilevel interconn...

Electroplating apparatus and electroplating method

Electronic device manufacturing method

Plating method and plating apparatus

Patents Applicationslast 30 patents

Method for generating pattern, method for manufacturing semiconduct...

Method of manufacturing a semiconductor device from which damage la...

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APP...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

PLATING APPARATUS

PLATING APPARATUS

Semiconductor device and manufacturing method of semiconductor device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for Fabricating Semiconductor Device

RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST...

Method for manufacturing a semiconductor device

Stress analysis method, wiring structure design method, program, an...

Bonding method and bonding apparatus

Method of manufacturing a semiconductor device from which damage la...

Semiconductor device and manufacturing method of semiconductor device

Wafer support plate, holding method of thin wafer, and manufacturin...

Method for generating pattern, method for manufacturing semiconduct...

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Method of producing semiconductor device

Reliability evaluation test apparatus, reliability evaluation test...

Substrate processing apparatus and substrate processing method

Plating method

Method of manufacturing semiconductor device

Simulation circuit pattern evaluation method, manufacturing method...

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device having multilevel interconn...

Method of manufacturing electronic device

Electronic device manufacturing method