Hisashi Minoura

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,765,692
- Issue date Aug 3, 2010
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,612,295
- Issue date Nov 3, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 7,594,320
- Issue date Sep 29, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board having a previously...
- Patent number 7,552,531
- Issue date Jun 30, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 7,339,118
- Issue date Mar 4, 2008
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,986,917
- Issue date Jan 17, 2006
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 6,825,421
- Issue date Nov 30, 2004
- Ibiden Co., Ltd.
- Masaru Takada
Information Patent Grant
Printed wiring board having throughole and annular lands
- Patent number 6,590,165
- Issue date Jul 8, 2003
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,555,208
- Issue date Apr 29, 2003
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing the same
- Patent number 6,455,783
- Issue date Sep 24, 2002
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 6,284,353
- Issue date Sep 4, 2001
- Ibiden Co., Ltd.
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting base board having heat slug with slit...
- Patent number 6,232,558
- Issue date May 15, 2001
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20130048355
- Publication date Feb 28, 2013
- IBIDEN CO., LTD.
- Toru FURUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090019693
- Publication date Jan 22, 2009
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board and Method for Manufacturing The Same
- Publication number 20060202344
- Publication date Sep 14, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20060042824
- Publication date Mar 2, 2006
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030203170
- Publication date Oct 30, 2003
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030150644
- Publication date Aug 14, 2003
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20010038905
- Publication date Nov 8, 2001
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS

Hisashi Minoura

Person

Patents Grantslast 30 patents

Method of manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

Method of manufacturing printed wiring board

Method of manufacturing a printed wiring board having a previously...

Printed wiring board and method for manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Printed wiring board having throughole and annular lands

Printed wiring board and method of manufacturing the same

Multilayer printed wiring board and method for manufacturing the same

Printed wiring board and method of manufacturing the same

Electronic component mounting base board having heat slug with slit...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Printed Wiring Board and Method for Manufacturing The Same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Printed wiring board and method of manufacturing the same