Hisashi Oshima

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and production method therefor
- Patent number 6,491,836
- Issue date Dec 10, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method for a wafer
- Patent number 6,358,117
- Issue date Mar 19, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing process for semiconductor wafer
- Patent number 6,284,658
- Issue date Sep 4, 2001
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface grinding method and apparatus for thin plate work
- Patent number 6,220,928
- Issue date Apr 24, 2001
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B24 - GRINDING POLISHING