Hisashi Shimizu

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Member bonding apparatus
- Patent number 9,726,916
- Issue date Aug 8, 2017
- ORIGIN ELECTRIC COMPANY, LIMITED
- Koji Yamaguchi
- G02 - OPTICS
Information Patent Grant
Method for handover
- Patent number 6,591,104
- Issue date Jul 8, 2003
- NTT Mobile Communications Network, Inc.
- Tomoyuki Ohtani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for handover
- Patent number 6,470,188
- Issue date Oct 22, 2002
- NTT Mobile Communications Network, Inc.
- Tomoyuki Ohtani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device having a pair of electrically connected insulatin...
- Patent number 5,041,014
- Issue date Aug 20, 1991
- Kabushiki Kaisha Toshiba
- Hisashi Shimizu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE MATERIAL STRUCTURE
- Publication number 20220338394
- Publication date Oct 20, 2022
- Mitsubishi Heavy Industries, Ltd.
- Tatsufumi AOI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE
- Publication number 20220078950
- Publication date Mar 10, 2022
- Mitsubishi Heavy Industries, Ltd.
- Yoshiaki ARAKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER BONDING APPARATUS
- Publication number 20150370098
- Publication date Dec 24, 2015
- ORIGIN ELECTRIC COMPANY, LIMITED
- Koji YAMAGUCHI
- G02 - OPTICS
Information Patent Application
Method for handover
- Publication number 20020151306
- Publication date Oct 17, 2002
- Tomoyuki Ohtani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE