Hisataka Minami

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing solution and polishing method
- Patent number 11,999,875
- Issue date Jun 4, 2024
- Resonac Corporation
- Yuya Otsuka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing-liquid set, polishing liquid, and polishing metho...
- Patent number 11,578,236
- Issue date Feb 14, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing liquid, polishing liquid set, and substrate polishing method
- Patent number 11,046,869
- Issue date Jun 29, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
CMP fluid and method for polishing palladium
- Patent number 10,796,921
- Issue date Oct 6, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasive, abrasive set, and method for polishing substrate
- Patent number 10,759,968
- Issue date Sep 1, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry, polishing-liquid set, polishing liquid, method for polishin...
- Patent number 10,752,807
- Issue date Aug 25, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing agent, polishing agent set, and substrate polishing method
- Patent number 10,557,058
- Issue date Feb 11, 2020
- Hitachi Chemical Company, Ltd.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 10,557,059
- Issue date Feb 11, 2020
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 10,549,399
- Issue date Feb 4, 2020
- HITACHI CHEMCIAL COMPANY, LTD.
- Tomohiro Iwano
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive, abrasive set, and method for abrading substrate
- Patent number 10,196,542
- Issue date Feb 5, 2019
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing liquid for CMP, and polishing method
- Patent number 10,155,886
- Issue date Dec 18, 2018
- Hitachi Chemical Company, Ltd.
- Munehiro Oota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Abrasive, abrasive set, and method for polishing substrate
- Patent number 10,030,172
- Issue date Jul 24, 2018
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 9,932,497
- Issue date Apr 3, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing solution and polishing method
- Patent number 9,799,532
- Issue date Oct 24, 2017
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing fluid, method for manufacturing same, method for manu...
- Patent number 9,447,306
- Issue date Sep 20, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive, abrasive set, and method for abrading substrate
- Patent number 9,346,977
- Issue date May 24, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 9,346,978
- Issue date May 24, 2016
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing agent, polishing agent set and method for polishing base
- Patent number 9,163,162
- Issue date Oct 20, 2015
- Hitachi Chemical Company, Ltd.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing abrasive grains, method for producing slurry,...
- Patent number 9,039,796
- Issue date May 26, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing solution for CMP, and method for polishing substrate usin...
- Patent number 8,900,473
- Issue date Dec 2, 2014
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CMP POLISHING LIQUID AND POLISHING METHOD
- Publication number 20230174822
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Mayumi KOMINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING LIQUID AND POLISHING METHOD
- Publication number 20230054199
- Publication date Feb 23, 2023
- Showa Denko Materials Co., Ltd.
- Shingo KOBAYASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SOLUTION AND POLISHING METHOD
- Publication number 20220251422
- Publication date Aug 11, 2022
- Showa Denko Materials Co., Ltd.
- Yuya OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...
- Publication number 20200325360
- Publication date Oct 15, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20180320024
- Publication date Nov 8, 2018
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD
- Publication number 20180258319
- Publication date Sep 13, 2018
- Hitachi Chemical Company, Ltd.
- Toshiaki AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20160319159
- Publication date Nov 3, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...
- Publication number 20160222252
- Publication date Aug 4, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING LIQUID FOR CMP, AND POLISHING METHOD
- Publication number 20160137881
- Publication date May 19, 2016
- Hitachi Chemical Company, Ltd.
- Munehiro OOTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE
- Publication number 20160040041
- Publication date Feb 11, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING BASE
- Publication number 20150232704
- Publication date Aug 20, 2015
- Hitachi Chemical Company, Ltd.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...
- Publication number 20150140904
- Publication date May 21, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...
- Publication number 20150139885
- Publication date May 21, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...
- Publication number 20150132208
- Publication date May 14, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE GRAINS, SLURRY, POLISHING SOLUTION, AND MANUFACTURING METH...
- Publication number 20150129796
- Publication date May 14, 2015
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...
- Publication number 20150098887
- Publication date Apr 9, 2015
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE
- Publication number 20150024596
- Publication date Jan 22, 2015
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING AGENT, POLISHING AGENT SET, AND SUBSTRATE POLISHING METHOD
- Publication number 20150017806
- Publication date Jan 15, 2015
- Hitachi Chemical Company, Ltd.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP POLISHING FLUID, METHOD FOR MANUFACTURING SAME, METHOD FOR MANU...
- Publication number 20140051250
- Publication date Feb 20, 2014
- HITACHI CHEMICAL COMPANY, LTD.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
- Publication number 20140017893
- Publication date Jan 16, 2014
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...
- Publication number 20130139447
- Publication date Jun 6, 2013
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...
- Publication number 20130140485
- Publication date Jun 6, 2013
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...
- Publication number 20120324800
- Publication date Dec 27, 2012
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP POLISHING SOLUTION AND POLISHING METHOD
- Publication number 20120238094
- Publication date Sep 20, 2012
- HITACHI CHEMICAL COMPANY, LTD.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Application
CMP Fluid and Method for Polishing Palladium
- Publication number 20120100718
- Publication date Apr 26, 2012
- HITACHI CHEMICAL COMPANY, LTD.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SOLUTION FOR CMP, AND METHOD FOR POLISHING SUBSTRATE USIN...
- Publication number 20110177690
- Publication date Jul 21, 2011
- Hitachi Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Application
CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
- Publication number 20100216309
- Publication date Aug 26, 2010
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hisataka Minami

Person

Patents Grantslast 30 patents

Polishing solution and polishing method

Slurry, polishing-liquid set, polishing liquid, and polishing metho...

Polishing liquid, polishing liquid set, and substrate polishing method

CMP fluid and method for polishing palladium

Abrasive, abrasive set, and method for polishing substrate

Slurry, polishing-liquid set, polishing liquid, method for polishin...

Polishing agent, polishing agent set, and substrate polishing method

Slurry, polishing-solution set, polishing solution, substrate polis...

Slurry, polishing-solution set, polishing solution, substrate polis...

Abrasive, abrasive set, and method for abrading substrate

Polishing liquid for CMP, and polishing method

Abrasive, abrasive set, and method for polishing substrate

Slurry, polishing-solution set, polishing solution, substrate polis...

CMP polishing solution and polishing method

CMP polishing fluid, method for manufacturing same, method for manu...

Abrasive, abrasive set, and method for abrading substrate

Slurry, polishing-solution set, polishing solution, substrate polis...

Polishing agent, polishing agent set and method for polishing base

Method for producing abrasive grains, method for producing slurry,...

Polishing solution for CMP, and method for polishing substrate usin...

Patents Applicationslast 30 patents

CMP POLISHING LIQUID AND POLISHING METHOD

CMP POLISHING LIQUID AND POLISHING METHOD

POLISHING SOLUTION AND POLISHING METHOD

SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...

POLISHING LIQUID FOR CMP, AND POLISHING METHOD

ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE

POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING BASE

SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...

SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...

SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...

ABRASIVE GRAINS, SLURRY, POLISHING SOLUTION, AND MANUFACTURING METH...

SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...

ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE

POLISHING AGENT, POLISHING AGENT SET, AND SUBSTRATE POLISHING METHOD

CMP POLISHING FLUID, METHOD FOR MANUFACTURING SAME, METHOD FOR MANU...

CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME

METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...

METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...

METHOD FOR PRODUCING ABRASIVE GRAINS, METHOD FOR PRODUCING SLURRY,...

CMP POLISHING SOLUTION AND POLISHING METHOD

CMP Fluid and Method for Polishing Palladium

POLISHING SOLUTION FOR CMP, AND METHOD FOR POLISHING SUBSTRATE USIN...

CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME