Hisato Takahashi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing solution and polishing method
- Patent number 11,999,875
- Issue date Jun 4, 2024
- Resonac Corporation
- Yuya Otsuka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing solution, polishing solution set, polishing method, and d...
- Patent number 11,926,764
- Issue date Mar 12, 2024
- Resonac Corporation
- Masayuki Hanano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,873,414
- Issue date Jan 16, 2024
- Resonac Corporation
- Yuma Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,186,742
- Issue date Nov 30, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,149,164
- Issue date Oct 19, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,111,407
- Issue date Sep 7, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition for sealing, and electronic componen...
- Patent number 11,059,966
- Issue date Jul 13, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Naoyuki Nojiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for electronic components and electronic c...
- Patent number 8,232,355
- Issue date Jul 31, 2012
- Hitachi Chemical Co., Ltd.
- Hisato Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFEC...
- Publication number 20230295466
- Publication date Sep 21, 2023
- Resonac Corporation
- Hisato TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP POLISHING LIQUID AND POLISHING METHOD
- Publication number 20230054199
- Publication date Feb 23, 2023
- Showa Denko Materials Co., Ltd.
- Shingo KOBAYASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING SOLUTION AND POLISHING METHOD
- Publication number 20220251422
- Publication date Aug 11, 2022
- Showa Denko Materials Co., Ltd.
- Yuya OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SOLUTION, POLISHING SOLUTION SET, POLISHING METHOD, AND D...
- Publication number 20220162476
- Publication date May 26, 2022
- Showa Denko Materials Co., Ltd.
- Masayuki HANANO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20210363380
- Publication date Nov 25, 2021
- Yuma TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT...
- Publication number 20200283659
- Publication date Sep 10, 2020
- Hitachi Chemical Company, Ltd.
- Hisato TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...
- Publication number 20200194325
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...
- Publication number 20200181392
- Publication date Jun 11, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20190233672
- Publication date Aug 1, 2019
- Hitachi Chemical Company, Ltd.
- Yuma TAKEUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
- Publication number 20190144660
- Publication date May 16, 2019
- Hitachi Chemical Company, Ltd.
- Yuma TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONEN...
- Publication number 20190127571
- Publication date May 2, 2019
- Hitachi Chemical Company, Ltd.
- Naoyuki NOJIRI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid Resin Composition for Electronic Components and Electronic C...
- Publication number 20090286930
- Publication date Nov 19, 2009
- Hisato Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hisato Takahashi

Person

Patents Grantslast 30 patents

Liquid resin composition for sealing and electronic component appar...

Polishing solution and polishing method

Polishing solution, polishing solution set, polishing method, and d...

Sealing resin composition, electronic component device, and method...

Sealing resin composition, electronic component device, and method...

Sealing resin composition, electronic component device, and method...

Sealing resin composition, electronic component device, and method...

Liquid epoxy resin composition for sealing, and electronic componen...

Liquid resin composition for electronic components and electronic c...

Patents Applicationslast 30 patents

POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFEC...

CMP POLISHING LIQUID AND POLISHING METHOD

POLISHING SOLUTION AND POLISHING METHOD

POLISHING SOLUTION, POLISHING SOLUTION SET, POLISHING METHOD, AND D...

SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...

POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT...

LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...

LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...

SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...

LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE

LIQUID EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONEN...

Liquid Resin Composition for Electronic Components and Electronic C...