Hisaya Sakai

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having wirings formed by damascene
- Patent number 8,546,949
- Issue date Oct 1, 2013
- Fujitsu Semiconductor Limited
- Michio Oryoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor de...
- Patent number 8,536,708
- Issue date Sep 17, 2013
- Fujitsu Semiconductor Limited
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring structure and semiconductor device compris...
- Patent number 8,373,274
- Issue date Feb 12, 2013
- Fujitsu Semiconductor Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor de...
- Patent number 8,338,953
- Issue date Dec 25, 2012
- Fujitsu Semiconductor Limited
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device using damascene method
- Patent number 8,101,513
- Issue date Jan 24, 2012
- Fujitsu Limited
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and semiconductor de...
- Patent number 8,030,207
- Issue date Oct 4, 2011
- Fujitsu Semiconductor Limited
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor apparatus, and semiconductor...
- Patent number 7,994,055
- Issue date Aug 9, 2011
- Fujitsu Semiconductor Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device having a barrier layer c...
- Patent number 7,935,624
- Issue date May 3, 2011
- Fujitsu Semiconductor Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wirings formed by damascene and its man...
- Patent number 7,906,433
- Issue date Mar 15, 2011
- Fujitsu Semiconductor Limited
- Michio Oryoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,579,277
- Issue date Aug 25, 2009
- Fujitsu Microelectronics Limited
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure forming method and semiconductor device
- Patent number 7,381,643
- Issue date Jun 3, 2008
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring structure and semiconductor device
- Patent number 7,358,180
- Issue date Apr 15, 2008
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,992,005
- Issue date Jan 31, 2006
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having increased adhesion between a barrier la...
- Patent number 6,900,542
- Issue date May 31, 2005
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,750,541
- Issue date Jun 15, 2004
- Fujitsu Limited
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20120326315
- Publication date Dec 27, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20110241211
- Publication date Oct 6, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF
- Publication number 20110021020
- Publication date Jan 27, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRINGS FORMED BY DAMASCENE
- Publication number 20100193965
- Publication date Aug 5, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Michio ORYOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20080284027
- Publication date Nov 20, 2008
- Fujitsu Limited
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR...
- Publication number 20080179747
- Publication date Jul 31, 2008
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming wiring structure and semiconductor device
- Publication number 20080142973
- Publication date Jun 19, 2008
- Fujitsu Limited
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication process thereof
- Publication number 20080067680
- Publication date Mar 20, 2008
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20080057717
- Publication date Mar 6, 2008
- Fujitsu Limited
- Tamotsu OWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having wirings formed by damascene and its man...
- Publication number 20070218671
- Publication date Sep 20, 2007
- FUJITSU LIMITED
- Michio Oryoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20070197032
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Tamotsu Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor device
- Publication number 20070173055
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor device using damascene method
- Publication number 20070134899
- Publication date Jun 14, 2007
- FUJITSU LIMITED
- Tsuyoshi Kanki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure forming method and semiconductor device
- Publication number 20060189115
- Publication date Aug 24, 2006
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming wiring structure and semiconductor device
- Publication number 20050194691
- Publication date Sep 8, 2005
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure forming method and semiconductor device
- Publication number 20050151263
- Publication date Jul 14, 2005
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040188839
- Publication date Sep 30, 2004
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040000716
- Publication date Jan 1, 2004
- FUJITSU LIMITED
- Hisaya Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020158338
- Publication date Oct 31, 2002
- FUJITSU LIMITED
- Nobuyuki Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS

Hisaya Sakai

Person

Patents Grantslast 30 patents

Semiconductor device having wirings formed by damascene

Method of manufacturing a semiconductor device and semiconductor de...

Method of forming wiring structure and semiconductor device compris...

Method of manufacturing a semiconductor device and semiconductor de...

Manufacture method for semiconductor device using damascene method

Method of manufacturing a semiconductor device and semiconductor de...

Method of manufacturing semiconductor apparatus, and semiconductor...

Fabrication method of semiconductor device having a barrier layer c...

Semiconductor device having wirings formed by damascene and its man...

Semiconductor device and method for fabricating the same

Wiring structure forming method and semiconductor device

Method of forming wiring structure and semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having increased adhesion between a barrier la...

Semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF

SEMICONDUCTOR DEVICE HAVING WIRINGS FORMED BY DAMASCENE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR...

Method of forming wiring structure and semiconductor device

Semiconductor device and fabrication process thereof

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device having wirings formed by damascene and its man...

Semiconductor device and method for fabricating the same

Fabrication method of semiconductor device

Manufacture method for semiconductor device using damascene method

Wiring structure forming method and semiconductor device

Method of forming wiring structure and semiconductor device

Wiring structure forming method and semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same