Hisaya Takahashi

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Toyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a Cu interconnect pattern
- Patent number 6,607,981
- Issue date Aug 19, 2003
- NEC Corporation
- Hisaya Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method for manufacturing same
- Patent number 6,563,057
- Issue date May 13, 2003
- NEC Toppan Circuit Solutions, Inc.
- Sinichi Hotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate with a solder resist layer and method of forming...
- Patent number 6,420,255
- Issue date Jul 16, 2002
- NEC Corporation
- Hisaya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making printed wiring boards
- Patent number 5,316,894
- Issue date May 31, 1994
- NEC Corporation
- Hisaya Takahashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Printed circuit board and method for manufacturing same
- Publication number 20020112885
- Publication date Aug 22, 2002
- Sinichi Hotta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Pattern forming method of forming a metallic pattern on a surface o...
- Publication number 20020051944
- Publication date May 2, 2002
- Nec Corporation and Masanobu Izaki
- Hisaya Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...