Hisayuki Imamura

Person

Fukaya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic circuit substrate and its production method
- Patent number 10,057,992
- Issue date Aug 21, 2018
- Hitachi Metals, Ltd.
- Hiroyuki Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material, brazing material paste, ceramic circuit substrate...
- Patent number 9,780,011
- Issue date Oct 3, 2017
- Hitachi Metals, Ltd.
- Hisayuki Imamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride substrate manufacturing method, silicon nitride sub...
- Patent number 8,858,865
- Issue date Oct 14, 2014
- Hitachi Metals, Ltd.
- Youichirou Kaga
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Circuit board and semiconductor module using this, production metho...
- Patent number 8,563,869
- Issue date Oct 22, 2013
- Hitachi Metals, Ltd.
- Youichirou Kaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride substrate, a manufacturing method of the silicon ni...
- Patent number 7,915,533
- Issue date Mar 29, 2011
- Hitachi Metals, Ltd.
- Youichirou Kaga
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Resin encapsulated semiconductor device and the production method
- Patent number 7,372,132
- Issue date May 13, 2008
- Hitachi, Ltd.
- Kazuhiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride powder, silicon nitride sintered body, sintered sil...
- Patent number 7,031,166
- Issue date Apr 18, 2006
- Hitachi Metals, Ltd.
- Hisayuki Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride powder, silicon nitride sintered body, sintered sil...
- Patent number 6,846,765
- Issue date Jan 25, 2005
- Hitachi Metals, Ltd.
- Hisayuki Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC CIRCUIT SUBSTRATE AND ITS PRODUCTION METHOD
- Publication number 20150216056
- Publication date Jul 30, 2015
- Hitachi Metals, Ltd.
- Hiroyuki Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING MATERIAL, BRAZING MATERIAL PASTE, CERAMIC CIRCUIT SUBSTRATE...
- Publication number 20140126155
- Publication date May 8, 2014
- Hitachi Metals, Ltd.
- Hisayuki Imamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SILICON NITRIDE SUBSTRATE MANUFACTURING METHOD, SILICON NITRIDE SUB...
- Publication number 20110272187
- Publication date Nov 10, 2011
- Hitachi Metals, Ltd.
- Youichirou Kaga
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THIS, PRODUCTION METHO...
- Publication number 20090101392
- Publication date Apr 23, 2009
- Hitachi Metals, Ltd.
- Youichirou Kaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON NITRIDE SUBSTRATE, A MANUFACTURING METHOD OF THE SILICON NI...
- Publication number 20090039477
- Publication date Feb 12, 2009
- Hitachi Metals, Ltd.
- Youichirou Kaga
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Power Semiconductor Module And Method of Manufacturing the Power Se...
- Publication number 20080315401
- Publication date Dec 25, 2008
- Hitachi, Ltd
- Hisayuki Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board and semiconductor device using the same
- Publication number 20050258550
- Publication date Nov 24, 2005
- Toshiaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin encapsulated semiconductor device and the production method
- Publication number 20050221538
- Publication date Oct 6, 2005
- Kazuhiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon nitride power, silicon nitride sintered body, sintered sili...
- Publication number 20050094381
- Publication date May 5, 2005
- HITACHI METALS, LTD
- Hisayuki Imamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Silicon nitride powder, silicon nitride sintered body, sintered sil...
- Publication number 20020164475
- Publication date Nov 7, 2002
- HITACHI METALS, LTD
- Hisayuki Imamura
- C01 - INORGANIC CHEMISTRY

Hisayuki Imamura

Person

Patents Grantslast 30 patents

Ceramic circuit substrate and its production method

Brazing material, brazing material paste, ceramic circuit substrate...

Silicon nitride substrate manufacturing method, silicon nitride sub...

Circuit board and semiconductor module using this, production metho...

Silicon nitride substrate, a manufacturing method of the silicon ni...

Resin encapsulated semiconductor device and the production method

Silicon nitride powder, silicon nitride sintered body, sintered sil...

Silicon nitride powder, silicon nitride sintered body, sintered sil...

Patents Applicationslast 30 patents

CERAMIC CIRCUIT SUBSTRATE AND ITS PRODUCTION METHOD

BRAZING MATERIAL, BRAZING MATERIAL PASTE, CERAMIC CIRCUIT SUBSTRATE...

SILICON NITRIDE SUBSTRATE MANUFACTURING METHOD, SILICON NITRIDE SUB...

CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THIS, PRODUCTION METHO...

SILICON NITRIDE SUBSTRATE, A MANUFACTURING METHOD OF THE SILICON NI...

Power Semiconductor Module And Method of Manufacturing the Power Se...

Circuit board and semiconductor device using the same

Resin encapsulated semiconductor device and the production method

Silicon nitride power, silicon nitride sintered body, sintered sili...

Silicon nitride powder, silicon nitride sintered body, sintered sil...