Hiten KOTHARI

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Resistive random access memory device and methods of fabrication
- Patent number 11,489,112
- Issue date Nov 1, 2022
- Intel Corporation
- Namrata S. Asuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive random access memory device with switching multi-layer st...
- Patent number 11,430,948
- Issue date Aug 30, 2022
- Intel Corporation
- Timothy Glassman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 11,393,754
- Issue date Jul 19, 2022
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchored interconnect
- Patent number 9,818,710
- Issue date Nov 14, 2017
- Intel Corporation
- Jiho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preservation of fine pitch redistribution lines
- Patent number 9,721,886
- Issue date Aug 1, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,530,740
- Issue date Dec 27, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising fine pitch single damascene ba...
- Patent number 9,449,913
- Issue date Sep 20, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,142,510
- Issue date Sep 22, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20240347465
- Publication date Oct 17, 2024
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20240006322
- Publication date Jan 4, 2024
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20220310516
- Publication date Sep 29, 2022
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A RESISTIVE RANDOM ACCESS MEMORY DEVICE WITH SWITCHING MULTI-LAYER...
- Publication number 20200203603
- Publication date Jun 25, 2020
- Intel Corporation
- Timothy Glassman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHODS OF FABRICATION
- Publication number 20200203602
- Publication date Jun 25, 2020
- Intel Corporation
- Namrata S. Asuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20200105672
- Publication date Apr 2, 2020
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING...
- Publication number 20190237391
- Publication date Aug 1, 2019
- Intel Corporation
- Seshu V. SATTIRAJU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORED INTERCONNECT
- Publication number 20170069589
- Publication date Mar 9, 2017
- Intel Corporation
- JIHO KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESERVATION OF FINE PITCH REDISTRIBUTION LINES
- Publication number 20160181196
- Publication date Jun 23, 2016
- INTEL CORPORATON
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20150364425
- Publication date Dec 17, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20130285257
- Publication date Oct 31, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...
- Publication number 20130256910
- Publication date Oct 3, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Hiten KOTHARI

Person

Patents Grantslast 30 patents

Resistive random access memory device and methods of fabrication

Resistive random access memory device with switching multi-layer st...

Contact over active gate structures with etch stop layers for advan...

Anchored interconnect

Preservation of fine pitch redistribution lines

3D interconnect structure comprising through-silicon vias combined...

3D interconnect structure comprising fine pitch single damascene ba...

3D interconnect structure comprising through-silicon vias combined...

Patents Applicationslast 30 patents

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

A RESISTIVE RANDOM ACCESS MEMORY DEVICE WITH SWITCHING MULTI-LAYER...

A RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHODS OF FABRICATION

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING...

ANCHORED INTERCONNECT

PRESERVATION OF FINE PITCH REDISTRIBUTION LINES

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...

3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BA...