Hitoshi Fujimoto

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of producing the same
- Patent number RE35496
- Issue date Apr 29, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- 174 - Electricity: conductors and insulators
Information Patent Grant
Semiconductor device
- Patent number 5,442,231
- Issue date Aug 15, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,334,803
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,087,590
- Issue date Feb 11, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Still image video telephone transmission system
- Patent number 5,042,061
- Issue date Aug 20, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Koji Kaneko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure of electrode junction for semiconductor device
- Patent number 5,003,373
- Issue date Mar 26, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 4,984,056
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for assembling semiconductor devices
- Patent number 4,982,728
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hisao Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for still picture video telephone apparatus and methods f...
- Patent number 4,962,521
- Issue date Oct 9, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Komatsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wire bonding apparatus
- Patent number 4,877,173
- Issue date Oct 31, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20090174051
- Publication date Jul 9, 2009
- Shuichi Osaka
- H01 - BASIC ELECTRIC ELEMENTS

Hitoshi Fujimoto

Person

Patents Grantslast 30 patents

Semiconductor device and method of producing the same

Semiconductor device

Semiconductor device and method of producing the same

Method of manufacturing semiconductor devices

Still image video telephone transmission system

Structure of electrode junction for semiconductor device

Semiconductor integrated circuit device

Apparatus for assembling semiconductor devices

Apparatus for still picture video telephone apparatus and methods f...

Wire bonding apparatus

Patents Applicationslast 30 patents

Semiconductor package and semiconductor device