Hitoshi Hoshino

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,626,324
- Issue date Apr 11, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 11,201,126
- Issue date Dec 14, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,133,219
- Issue date Sep 28, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 10,727,128
- Issue date Jul 28, 2020
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a substrate
- Patent number 10,682,728
- Issue date Jun 16, 2020
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a wafer and wafer processing system
- Patent number 10,242,913
- Issue date Mar 26, 2019
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer and wafer processing system
- Patent number 9,935,010
- Issue date Apr 3, 2018
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20210183704
- Publication date Jun 17, 2021
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WORKPIECE AND SYSTEM FOR PROCESSING A WORKPIECE
- Publication number 20200381303
- Publication date Dec 3, 2020
- Disco Corporation
- Hitoshi HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE
- Publication number 20200251431
- Publication date Aug 6, 2020
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20190252254
- Publication date Aug 15, 2019
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20190221480
- Publication date Jul 18, 2019
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20190030648
- Publication date Jan 31, 2019
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM
- Publication number 20180211877
- Publication date Jul 26, 2018
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM
- Publication number 20170365519
- Publication date Dec 21, 2017
- Disco Corporation
- Karl Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hitoshi Hoshino

Person

Patents Grantslast 30 patents

Method of processing a workpiece and system for processing a workpiece

Method of processing a wafer

Method of producing a substrate and system for producing a substrate

Method of processing a wafer

Method of processing a wafer

Method of processing a substrate

Method of processing a wafer and wafer processing system

Method of processing a wafer and wafer processing system

Patents Applicationslast 30 patents

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING A WORKPIECE AND SYSTEM FOR PROCESSING A WORKPIECE

METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING A WAFER

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM

METHOD OF PROCESSING A WAFER AND WAFER PROCESSING SYSTEM