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Hitoshi KONDO

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  • Nagano, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of manufacturing wiring board
    • Patent number 11,001,930
    • Issue date May 11, 2021
    • SHINKO ELECTRIC INDUSTRIES CO, LTD.
    • Tomoyuki Shimodaira
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Interconnect substrate
    • Patent number 10,510,649
    • Issue date Dec 17, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Kita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board
    • Patent number 10,398,027
    • Issue date Aug 27, 2019
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Oshima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Carrier base material-added wiring substrate
    • Patent number 10,340,214
    • Issue date Jul 2, 2019
    • Shinko Electric Industries Co., Ltd.
    • Junji Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board and semiconductor device
    • Patent number 10,109,580
    • Issue date Oct 23, 2018
    • Shinko Electric Industries Co., Ltd.
    • Shunichiro Matsumoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board
    • Patent number 10,080,292
    • Issue date Sep 18, 2018
    • Shinko Electric Industries Co., Ltd.
    • Junji Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Carrier base material-added wiring substrate
    • Patent number 9,905,504
    • Issue date Feb 27, 2018
    • Shinko Electric Industries Co., Ltd.
    • Junji Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board and electronic component device
    • Patent number 9,711,476
    • Issue date Jul 18, 2017
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board and method of manufacturing the same
    • Patent number 9,060,455
    • Issue date Jun 16, 2015
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate and method of manufacturing the same
    • Patent number 8,669,478
    • Issue date Mar 11, 2014
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 8,450,852
    • Issue date May 28, 2013
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing wiring substrate
    • Patent number 8,052,882
    • Issue date Nov 8, 2011
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi Kondo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20230120515
    • Publication date Apr 20, 2023
    • Shinko Electric Industries Co., Ltd.
    • Hikaru TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20230123522
    • Publication date Apr 20, 2023
    • Shinko Electric Industries Co., Ltd.
    • Hikaru TANAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
    • Publication number 20230089948
    • Publication date Mar 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Takashi Kasuga
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING WIRING BOARD
    • Publication number 20200413545
    • Publication date Dec 31, 2020
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki SHIMODAIRA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE
    • Publication number 20190371717
    • Publication date Dec 5, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro KITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20190181084
    • Publication date Jun 13, 2019
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Oshima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CARRIER BASE MATERIAL-ADDED WIRING SUBSTRATE
    • Publication number 20180090426
    • Publication date Mar 29, 2018
    • Shinko Electric Industries Co., Ltd.
    • JUNJI SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20180014407
    • Publication date Jan 11, 2018
    • Shinko Electric Industries Co., Ltd.
    • Junji SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND SEMICONDUCTOR DEVICE
    • Publication number 20170179022
    • Publication date Jun 22, 2017
    • Shinko Electric Industries Co., Ltd.
    • Shunichiro MATSUMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
    • Publication number 20160365327
    • Publication date Dec 15, 2016
    • Shinko Electric Industries Co., Ltd.
    • Tomoyuki Shimodaira
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20130062108
    • Publication date Mar 14, 2013
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20110316148
    • Publication date Dec 29, 2011
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20110308849
    • Publication date Dec 22, 2011
    • SHINKO ELECTRIC INDUSTRIES CO. LTD.
    • Hitoshi KONDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20110297425
    • Publication date Dec 8, 2011
    • Shinko Electric Industries Co., Ltd.
    • Junichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20110290536
    • Publication date Dec 1, 2011
    • Shinko Electric Industries Co., Ltd.
    • Kentaro Kaneko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20090288870
    • Publication date Nov 26, 2009
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING WIRING SUBSTRATE
    • Publication number 20090283497
    • Publication date Nov 19, 2009
    • Shinko Electric Industries Co., Ltd.
    • Hitoshi KONDO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR