Hitoshi Mukojima

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component placement machine having camera units with ver...
- Patent number 7,191,511
- Issue date Mar 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component placement method
- Patent number 7,007,377
- Issue date Mar 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste applicator and paste application method for die bonding
- Patent number 6,685,777
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste application method for die bonding
- Patent number 6,361,831
- Issue date Mar 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste applying method
- Patent number 6,348,234
- Issue date Feb 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic component placement machine and electronic component pla...
- Publication number 20050132567
- Publication date Jun 23, 2005
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component placement machine and electronic component pla...
- Publication number 20040163243
- Publication date Aug 26, 2004
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Paste applicator and paste application method for die bonding
- Publication number 20020037372
- Publication date Mar 28, 2002
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS