Hitoshi Narushima

Person

Shizuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film for electronic parts
- Patent number 6,426,138
- Issue date Jul 30, 2002
- Tomoegawa Paper Co., Ltd.
- Hitoshi Narushima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for electronic parts and adhesive tape for electronic parts
- Patent number 6,329,050
- Issue date Dec 11, 2001
- Tomoegawa Paper Co., Ltd.
- Ken Yoshioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for electronic parts and adhesive tape for electronic parts
- Patent number 6,187,874
- Issue date Feb 13, 2001
- Tomoegawa Paper Co., Ltd.
- Ken Yoshioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for tape automated bonding
- Patent number 5,945,188
- Issue date Aug 31, 1999
- Tomoegawa Paper Co., Ltd.
- Akinori Sei
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive for semiconductor devices and adhesive tape using the adhe...
- Patent number 5,786,055
- Issue date Jul 28, 1998
- Tomoegawa Paper Co., Ltd.
- Akinori Sei
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive paper for tape automated bonding
- Patent number 5,523,137
- Issue date Jun 4, 1996
- Tomoegawa Paper Co., Ltd.
- Akinori Sei
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Block copolymer and method of producing the same
- Patent number 5,342,895
- Issue date Aug 30, 1994
- Tomoegawa Paper Co., Ltd.
- Toshio Tagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tapes for tape automated bonding
- Patent number 5,298,304
- Issue date Mar 29, 1994
- Tomoegawa Paper Co., Ltd.
- Hitoshi Narushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tapes for tape automated bonding
- Patent number 5,290,614
- Issue date Mar 1, 1994
- Tomoegawa Paper Co., Ltd.
- Hitoshi Narushima
- H01 - BASIC ELECTRIC ELEMENTS

Hitoshi Narushima

Person

Patents Grantslast 30 patents

Adhesive film for electronic parts

Adhesive for electronic parts and adhesive tape for electronic parts

Adhesive for electronic parts and adhesive tape for electronic parts

Adhesive tape for tape automated bonding

Adhesive for semiconductor devices and adhesive tape using the adhe...

Adhesive paper for tape automated bonding

Block copolymer and method of producing the same

Adhesive tapes for tape automated bonding

Adhesive tapes for tape automated bonding