Hitoshi Odashima

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 7,265,035
- Issue date Sep 4, 2007
- Renesas Technology Corp.
- Hiroshi Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mounting semiconductor device, semiconductor...
- Patent number 6,629,553
- Issue date Oct 7, 2003
- Hitachi, Ltd.
- Hitoshi Odashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for separating semiconductor chips
- Patent number 6,602,736
- Issue date Aug 5, 2003
- Hitachi, Ltd.
- Makoto Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,551,449
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump forming method and apparatus therefor
- Patent number 6,460,755
- Issue date Oct 8, 2002
- Hitachi, Ltd.
- Kosuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding method, semiconductor device and method of manufacturing s...
- Patent number 6,406,357
- Issue date Jun 18, 2002
- Hitachi, Ltd.
- Shinichi Kazui
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,203,655
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Minute particle loading method and apparatus
- Patent number 5,279,045
- Issue date Jan 18, 1994
- Hitachi, Ltd.
- Hitoshi Odashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting coils inside a hollow cylindrical...
- Patent number 4,882,833
- Issue date Nov 28, 1989
- Hitachi, Ltd.
- Hiromichi Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parts-connecting apparatus using solder
- Patent number 4,620,663
- Issue date Nov 4, 1986
- Hitachi, Ltd.
- Hitoshi Odashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RFID tag and manufacturing method thereof
- Publication number 20070007344
- Publication date Jan 11, 2007
- Kosuke Inoue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060252233
- Publication date Nov 9, 2006
- Hiroshi Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for separating semiconductor chips
- Publication number 20040083602
- Publication date May 6, 2004
- Makoto Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for mounting semiconductor device, semiconductor...
- Publication number 20020072202
- Publication date Jun 13, 2002
- Hitoshi Odashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for mounting semiconductor device, semiconductor...
- Publication number 20020046450
- Publication date Apr 25, 2002
- Hitoshi Odashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for mounting semiconductor device, semiconductor...
- Publication number 20020036895
- Publication date Mar 28, 2002
- Hitoshi Odashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for mounting semiconductor device, semiconductor...
- Publication number 20020024883
- Publication date Feb 28, 2002
- Hitoshi Odashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin electronic circuit component and method and apparatus for prod...
- Publication number 20010050138
- Publication date Dec 13, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING

Hitoshi Odashima

Person

Patents Grantslast 30 patents

Semiconductor device and its manufacturing method

Method and system for mounting semiconductor device, semiconductor...

Method and apparatus for separating semiconductor chips

Thin electronic circuit component and method and apparatus for prod...

Bump forming method and apparatus therefor

Grinding method, semiconductor device and method of manufacturing s...

Thin electronic circuit component and method and apparatus for prod...

Minute particle loading method and apparatus

Method and apparatus for mounting coils inside a hollow cylindrical...

Parts-connecting apparatus using solder

Patents Applicationslast 30 patents

RFID tag and manufacturing method thereof

Semiconductor device and its manufacturing method

Method and apparatus for separating semiconductor chips

Method and system for mounting semiconductor device, semiconductor...

Method and system for mounting semiconductor device, semiconductor...

Method and system for mounting semiconductor device, semiconductor...

Method and system for mounting semiconductor device, semiconductor...

Thin electronic circuit component and method and apparatus for prod...