Hitoshi Ohashi

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet
- Patent number 9,878,520
- Issue date Jan 30, 2018
- Hitoshi Ohashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Treating method for brittle member
- Patent number 8,113,914
- Issue date Feb 14, 2012
- Lintec Corporation
- Hitoshi Ohashi
- B24 - GRINDING POLISHING
Information Patent Grant
Surface-protecting sheet and semiconductor wafer lapping method
- Patent number 7,438,631
- Issue date Oct 21, 2008
- Lintec Corporation
- Koichi Nagamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer protection structure and laminated protective s...
- Patent number 7,361,971
- Issue date Apr 22, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensitive adhesive sheet for use in semiconductor working...
- Patent number 7,351,645
- Issue date Apr 1, 2008
- Lintec Corporation
- Hitoshi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TREATING METHOD FOR BRITTLE MEMBER
- Publication number 20080305721
- Publication date Dec 11, 2008
- LINTEC CORPORATION
- Hitoshi OHASHI
- B24 - GRINDING POLISHING
Information Patent Application
Adhesive Sheet
- Publication number 20080220253
- Publication date Sep 11, 2008
- LINTEC CORPORATION
- Hitoshi Ohashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface-protecting sheet and semiconductor wafer lapping method
- Publication number 20070066184
- Publication date Mar 22, 2007
- Lintec Corporation
- Koichi Nagamoto
- B24 - GRINDING POLISHING
Information Patent Application
Protective structure of semiconductor wafer, method for protecting...
- Publication number 20060043532
- Publication date Mar 2, 2006
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure sensitive adhesive sheet for use in semiconductor working...
- Publication number 20050269717
- Publication date Dec 8, 2005
- Lintec Corporation
- Hitoshi Ohashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...