HItoshi Onozeki

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board production method, adhesive layer-e...
- Patent number 10,893,616
- Issue date Jan 12, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Two-layered laminate having metal foil cladded on its one surface,...
- Patent number 10,051,743
- Issue date Aug 14, 2018
- Hitachi Chemical Company, Ltd.
- Hitoshi Onozeki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent fitted metal foil, and printed wiring boar...
- Patent number 7,740,936
- Issue date Jun 22, 2010
- Hitachi Chemical Co., Ltd.
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED...
- Publication number 20240018306
- Publication date Jan 18, 2024
- RESONAC CORPORATION
- Satoshi YONEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER SHEET COMPOSITION AND BUFFER SHEET
- Publication number 20180340056
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Yuta Koseki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD PRODUCTION METHOD, ADHESIVE LAYER-E...
- Publication number 20180235090
- Publication date Aug 16, 2018
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-LAYERED LAMINATE HAVING METAL FOIL CLADDED ON ITS ONE SURFACE,...
- Publication number 20110108310
- Publication date May 12, 2011
- Hitoshi Onozeki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...
- Publication number 20080145689
- Publication date Jun 19, 2008
- Nobuyuki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

HItoshi Onozeki

Person

Patents Grantslast 30 patents

Semiconductor element mounting structure, and combination of semico...

Multilayer printed wiring board production method, adhesive layer-e...

Two-layered laminate having metal foil cladded on its one surface,...

Adhesion assisting agent fitted metal foil, and printed wiring boar...

Patents Applicationslast 30 patents

RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED...

METHOD FOR USING A BUFFER SHEET

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...

BUFFER SHEET COMPOSITION AND BUFFER SHEET

MULTILAYER PRINTED WIRING BOARD PRODUCTION METHOD, ADHESIVE LAYER-E...

TWO-LAYERED LAMINATE HAVING METAL FOIL CLADDED ON ITS ONE SURFACE,...

Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Boar...