Hitoshi Saito

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Patents Grantslast 30 patents

Information Patent Grant
Inductively-coupled plasma processing apparatus
- Patent number 12,154,760
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Hitoshi Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER-LAYER ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250046579
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Hirotoshi SAKAUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductively-Coupled Plasma Processing Apparatus
- Publication number 20200227236
- Publication date Jul 16, 2020
- TOKYO ELECTRON LIMITED
- Hitoshi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing apparatus and plasma processing method
- Publication number 20050241769
- Publication date Nov 3, 2005
- TOKYO ELECTRON LIMITED
- Tsutomu Satoyoshi
- H01 - BASIC ELECTRIC ELEMENTS