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Hitoshi Sakurai
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Kakogawa-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Solder precoating method
Patent number
7,569,164
Issue date
Aug 4, 2009
Harima Chemicals, Inc.
Hitoshi Sakurai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder deposition method and solder bump forming method
Patent number
7,452,797
Issue date
Nov 18, 2008
Harima Chemicals, Inc.
Youichi Kukimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for removing resin mask layer and method for manufacturing s...
Patent number
7,291,517
Issue date
Nov 6, 2007
Harima Chemicals, Inc.
Hitoshi Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SOLDERING PASTE FLUX AND SOLDERING PASTE
Publication number
20140083567
Publication date
Mar 27, 2014
Harima Chemicals, Inc
Teruyoshi Hamagawa
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC PO...
Publication number
20100270365
Publication date
Oct 28, 2010
Harima Chemicals, Inc.
Yoichi KUKIMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solder paste composition and solder precoating method
Publication number
20080179383
Publication date
Jul 31, 2008
HARIMA CHEMICALS, INC.
Hitoshi Sakurai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBS...
Publication number
20080160331
Publication date
Jul 3, 2008
HARIMA CHEMICALS, INC.
Yoichi Kukimoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for removing resin mask layer and method for manufacturing s...
Publication number
20060110907
Publication date
May 25, 2006
HARIMA CHEMICALS, INC.
Hitoshi Sakurai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solder deposition method and solder bump forming method
Publication number
20040209451
Publication date
Oct 21, 2004
HARIMA CHEMICALS, INC.
Youichi Kukimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR