Hitoshi TAKEUCHI

Person

Chiba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Stator, movement, timepiece, method for manufacturing movement and...
- Patent number 11,929,640
- Issue date Mar 12, 2024
- Seiko Instruments Inc.
- Kosuke Yamamoto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lid body portion and electronic device package using the lid body p...
- Patent number 9,370,104
- Issue date Jun 14, 2016
- Seiko Instruments Inc.
- Masayuki Satoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical sensor and method of manufacturing the optical sensor
- Patent number 8,785,839
- Issue date Jul 22, 2014
- Seiko Instruments Inc.
- Hitoshi Takeuchi
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component and electronic device
- Patent number 8,441,799
- Issue date May 14, 2013
- Seiko Instruments Inc.
- Hitoshi Takeuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device, electronic apparatus, and electronic device manu...
- Patent number 8,405,463
- Issue date Mar 26, 2013
- Seiko Instruments Inc.
- Takahiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,278,567
- Issue date Oct 2, 2012
- Seiko Instruments Inc.
- Takahiko Nakamura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing electronic-parts package
- Patent number 8,256,107
- Issue date Sep 4, 2012
- Seiko Instruments Inc.
- Takahiko Nakamura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package having stress buffer layer on mounting surface t...
- Patent number 7,923,904
- Issue date Apr 12, 2011
- Seiko Instruments Inc.
- Hitoshi Takeuchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor sensor device comprised of plural sensor chips connec...
- Patent number 5,977,575
- Issue date Nov 2, 1999
- Seiko Instruments Inc.
- Masaaki Mandai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a trapezoidal joint chip
- Patent number 5,869,893
- Issue date Feb 9, 1999
- Seiko Instruments Inc.
- Osamu Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device composed of plural semiconductor chips and cou...
- Patent number 5,744,379
- Issue date Apr 28, 1998
- Seiko Instruments, Inc.
- Masaaki Mandai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 5,639,693
- Issue date Jun 17, 1997
- Seiko Instruments Inc.
- Osamu Koseki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STATOR, MOVEMENT, TIMEPIECE, METHOD FOR MANUFACTURING MOVEMENT AND...
- Publication number 20210091607
- Publication date Mar 25, 2021
- SEIKO INSTRUMENTS INC.
- Kosuke YAMAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LID BODY PORTION AND ELECTRONIC DEVICE PACKAGE USING THE LID BODY P...
- Publication number 20150022988
- Publication date Jan 22, 2015
- SEIKO INSTRUMENTS INC.
- Masayuki SATOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR
- Publication number 20120248298
- Publication date Oct 4, 2012
- Hitoshi Takeuchi
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20120153779
- Publication date Jun 21, 2012
- Keiji Sato
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANU...
- Publication number 20120044025
- Publication date Feb 23, 2012
- Takahiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING...
- Publication number 20110179613
- Publication date Jul 28, 2011
- Yoichi Funabiki
- G04 - HOROLOGY
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100326721
- Publication date Dec 30, 2010
- Takahiko NAKAMURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND BASE MEMBER MANUFAC...
- Publication number 20100295421
- Publication date Nov 25, 2010
- Hitoshi TAKEUCHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT...
- Publication number 20100290201
- Publication date Nov 18, 2010
- Hitoshi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100053918
- Publication date Mar 4, 2010
- Takahiko Nakamura
- H03 - BASIC ELECTRONIC CIRCUITRY

Hitoshi TAKEUCHI

Person

Patents Grantslast 30 patents

Stator, movement, timepiece, method for manufacturing movement and...

Lid body portion and electronic device package using the lid body p...

Optical sensor and method of manufacturing the optical sensor

Electronic component and electronic device

Electronic device, electronic apparatus, and electronic device manu...

Electronic device and method of manufacturing the same

Method of manufacturing electronic-parts package

Electronic package having stress buffer layer on mounting surface t...

Semiconductor sensor device comprised of plural sensor chips connec...

Semiconductor device having a trapezoidal joint chip

Semiconductor device composed of plural semiconductor chips and cou...

Semiconductor device and process for fabricating the same

Patents Applicationslast 30 patents

STATOR, MOVEMENT, TIMEPIECE, METHOD FOR MANUFACTURING MOVEMENT AND...

LID BODY PORTION AND ELECTRONIC DEVICE PACKAGE USING THE LID BODY P...

OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR

ELECTRONIC COMPONENT

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANU...

PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND BASE MEMBER MANUFAC...

ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT...

ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR