Hitoshi Watanabe

Person

  • Musashimurayama-shi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding data setting device and method

    • Patent number 6,901,305
    • Issue date May 31, 2005
    • Kabushiki Kaisha Shinkawa
    • Kazumasa Kimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Bonding data setting device and method

    • Publication number 20020079348
    • Publication date Jun 27, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Kazumasa Kimura
    • H01 - BASIC ELECTRIC ELEMENTS