Ho-Chieh Yu

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Motor control device with built-in current sensing resistor and pow...
- Patent number 11,043,911
- Issue date Jun 22, 2021
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ceramic substrate component/assembly with raised thermal metal pad,...
- Patent number 10,743,411
- Issue date Aug 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with built-in vertical heat dissipation ceram...
- Patent number 10,524,349
- Issue date Dec 31, 2019
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-type protection device having enclosed micro-gap between elect...
- Patent number 8,072,730
- Issue date Dec 6, 2011
- TA-I Technology Co., Ltd.
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale gas discharge protective device and fabrication method o...
- Patent number 7,733,620
- Issue date Jun 8, 2010
- TA-I Technology Co., Ltd
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
- Publication number 20240114614
- Publication date Apr 4, 2024
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver
- Publication number 20230378145
- Publication date Nov 23, 2023
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...
- Publication number 20200245456
- Publication date Jul 30, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Motor Control Device with Built-in Current Sensing Resistor and Pow...
- Publication number 20200186067
- Publication date Jun 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Printed Circuit Board with Built-In Vertical Heat Dissipation Ceram...
- Publication number 20180352646
- Publication date Dec 6, 2018
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TYPE PROTECTION DEVICE HAVING ENCLOSED MICRO-GAP BETWEEN ELECT...
- Publication number 20100020458
- Publication date Jan 28, 2010
- IA-I TECHNOLOGY CO., LTD
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE GAS DISCHARGE PROTECTIVE DEVICE AND FABRICATION METHOD O...
- Publication number 20080239610
- Publication date Oct 2, 2008
- Ho-Chieh Yu
- H01 - BASIC ELECTRIC ELEMENTS

Ho-Chieh Yu

Person

Patents Grantslast 30 patents

Motor control device with built-in current sensing resistor and pow...

Ceramic substrate component/assembly with raised thermal metal pad,...

Printed circuit board with built-in vertical heat dissipation ceram...

Chip-type protection device having enclosed micro-gap between elect...

Chip scale gas discharge protective device and fabrication method o...

Patents Applicationslast 30 patents

Thermal Conduction - Electrical Conduction Isolated Circuit Board w...

Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver

Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...

Motor Control Device with Built-in Current Sensing Resistor and Pow...

Printed Circuit Board with Built-In Vertical Heat Dissipation Ceram...

CHIP-TYPE PROTECTION DEVICE HAVING ENCLOSED MICRO-GAP BETWEEN ELECT...

CHIP SCALE GAS DISCHARGE PROTECTIVE DEVICE AND FABRICATION METHOD O...