Ho Kian Seng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,138,617
- Issue date Mar 20, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaged die
- Patent number 7,358,154
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 7,018,270
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 6,939,199
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 6,894,386
- Issue date May 17, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting semiconductor wafers
- Patent number 6,576,531
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20060084240
- Publication date Apr 20, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20050268763
- Publication date Dec 8, 2005
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20050029668
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20030203538
- Publication date Oct 30, 2003
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20030067001
- Publication date Apr 10, 2003
- Micron Technology, Inc.
- Chin Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CUTTING SEMICONDUCTOR WAFERS
- Publication number 20030060022
- Publication date Mar 27, 2003
- Neo Chee Peng
- B28 - WORKING CEMENT, CLAY, OR STONE