Ho Ming Tong

Person

Shrlin Chiu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and manufacturing method thereof and package stru...
- Patent number 8,258,009
- Issue date Sep 4, 2012
- Advanced Semiconductor Engineering Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for packaging a semiconductor package
- Patent number 8,076,786
- Issue date Dec 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Chang Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced package structure
- Patent number 8,059,422
- Issue date Nov 15, 2011
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method for enhancing the bond of a bonding w...
- Patent number 8,018,075
- Issue date Sep 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package process
- Patent number 7,614,888
- Issue date Nov 10, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method for wire-bonding apparatus
- Patent number 7,581,666
- Issue date Sep 1, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
- Patent number 7,547,575
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and manufacturing method thereof
- Patent number 7,445,944
- Issue date Nov 4, 2008
- ASE (Shanghai) Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 7,064,428
- Issue date Jun 20, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method for making the same
- Patent number 7,041,534
- Issue date May 9, 2006
- Advanced Semiconductor Engineering, Inc.
- Shin Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,989,326
- Issue date Jan 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication process
- Patent number 6,967,153
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for preventing burnt fuse pad from further electrical con...
- Patent number 6,927,964
- Issue date Aug 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallurgy layer for improving adhesion
- Patent number 6,891,274
- Issue date May 10, 2005
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated probe structure
- Patent number 6,891,360
- Issue date May 10, 2005
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of modifying tin to lead ratio in tin-lead bump
- Patent number 6,877,653
- Issue date Apr 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bump
- Patent number 6,875,683
- Issue date Apr 5, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump and fabricating process thereof
- Patent number 6,864,168
- Issue date Mar 8, 2005
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball fabricating process
- Patent number 6,861,346
- Issue date Mar 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating wafer bumps
- Patent number 6,846,719
- Issue date Jan 25, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,827,252
- Issue date Dec 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under-ball-metallurgy layer
- Patent number 6,819,002
- Issue date Nov 16, 2004
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and testing method for the same
- Patent number 6,768,332
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering Inc.
- Yueh Lung Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method for preventing burnt fuse pad from further electrical connec...
- Patent number 6,756,256
- Issue date Jun 29, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication process
- Patent number 6,743,707
- Issue date Jun 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball attaching process
- Patent number 6,732,912
- Issue date May 11, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball fabrication process
- Patent number 6,723,630
- Issue date Apr 20, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication method
- Patent number 6,720,244
- Issue date Apr 13, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
- Publication number 20240128146
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240047343
- Publication date Feb 8, 2024
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047192
- Publication date Feb 8, 2024
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240047298
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD SYSTEM, METHOD OF MANUFACTURING PROBE CARD SYSTEM, METHO...
- Publication number 20240027494
- Publication date Jan 25, 2024
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006301
- Publication date Jan 4, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387032
- Publication date Nov 30, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC...
- Publication number 20230317443
- Publication date Oct 5, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268288
- Publication date Aug 24, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...
- Publication number 20230238345
- Publication date Jul 27, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND ENHANCED ADVANCED ICS AND ADVANCED IC PACKAGES
- Publication number 20230154825
- Publication date May 18, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING W...
- Publication number 20100007010
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE
- Publication number 20100007011
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Chang Ying HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE PROCESS
- Publication number 20090087947
- Publication date Apr 2, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE
- Publication number 20090075027
- Publication date Mar 19, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B32 - LAYERED PRODUCTS
Information Patent Application
Packaging substrate and manufacturing method thereof
- Publication number 20080124836
- Publication date May 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
- Publication number 20080085571
- Publication date Apr 10, 2008
- Advanced Semiconductor Engeneering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and method of manufacturing the same
- Publication number 20080044931
- Publication date Feb 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonding apparatus and wire-bonding method thereof
- Publication number 20080035706
- Publication date Feb 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
- Publication number 20060103020
- Publication date May 18, 2006
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package, semiconductor package with bumps and method for...
- Publication number 20050233571
- Publication date Oct 20, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump and fabricating process thereof
- Publication number 20050200014
- Publication date Sep 15, 2005
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20050161812
- Publication date Jul 28, 2005
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS

Ho Ming Tong

Person

Patents Grantslast 30 patents

Circuit substrate and manufacturing method thereof and package stru...

Wafer and semiconductor package

Semiconductor package and method for packaging a semiconductor package

Thermally enhanced package structure

Semiconductor package and method for processing and bonding a wire

Semiconductor package, method for enhancing the bond of a bonding w...

Flip chip package process

Wire-bonding method for wire-bonding apparatus

Two-stage die-bonding method for simultaneous die-bonding of multip...

Packaging substrate and manufacturing method thereof

Wafer-level package structure

Semiconductor chip package and method for making the same

Bump manufacturing method

Bump fabrication process

Structure for preventing burnt fuse pad from further electrical con...

Under-bump-metallurgy layer for improving adhesion

Plated probe structure

Method of modifying tin to lead ratio in tin-lead bump

Method of forming bump

Bump and fabricating process thereof

Solder ball fabricating process

Process for fabricating wafer bumps

Bump manufacturing method

Under-ball-metallurgy layer

Semiconductor wafer and testing method for the same

Method for preventing burnt fuse pad from further electrical connec...

Bump fabrication process

Solder ball attaching process

Solder ball fabrication process

Bump fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING

SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

PROBE CARD SYSTEM, METHOD OF MANUFACTURING PROBE CARD SYSTEM, METHO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC...

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...

DIAMOND ENHANCED ADVANCED ICS AND ADVANCED IC PACKAGES

WAFER AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING W...

SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE

SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE

FLIP CHIP PACKAGE PROCESS

MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE

Packaging substrate and manufacturing method thereof

Wire-bonding method for wire-bonding apparatus

DIE BONDER AND DIE BONDING METHOD THEREOF

Packaging substrate and method of manufacturing the same

Wire-bonding apparatus and wire-bonding method thereof

REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF

Flip chip package, semiconductor package with bumps and method for...

Bump and fabricating process thereof

WAFER-LEVEL PACKAGE STRUCTURE