Ho S. Chen

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Lebanon, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free alloys for use in solder bonding
- Patent number 5,698,160
- Issue date Dec 16, 1997
- Lucent Technologies Inc.
- Ho Sou Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding scheme using group VB metallic layer
- Patent number 5,622,305
- Issue date Apr 22, 1997
- Lucent Technologies Inc.
- Donald D. Bacon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free low melting solder with improved mechanical properties
- Patent number 5,569,433
- Issue date Oct 29, 1996
- Lucent Technologies Inc.
- Ho S. Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Article comprising a PB-free solder having improved mechanical prop...
- Patent number 5,538,686
- Issue date Jul 23, 1996
- AT&T Corp.
- Ho S. Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR