Ho-Sik Jun

Person

Chungcheongbuk-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronic component
- Patent number 12,224,123
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,062,493
- Issue date Aug 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,721,480
- Issue date Aug 8, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,657,966
- Issue date May 23, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyeong Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,605,502
- Issue date Mar 14, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hye Sung Pyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 11,289,270
- Issue date Mar 29, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered ceramic electronic component
- Patent number 11,222,748
- Issue date Jan 11, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gi Seok Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered ceramic electronic component having step absorption l...
- Patent number 11,164,702
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gi Seok Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 11,094,468
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Reum Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component and method for manufacturing the same
- Patent number 11,062,847
- Issue date Jul 13, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hye Won Ryoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having dummy pattern
- Patent number 11,037,733
- Issue date Jun 15, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 11,017,953
- Issue date May 25, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyeong Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 10,854,384
- Issue date Dec 1, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sun Cheol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 10,755,860
- Issue date Aug 25, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component and method for manufacturing the same
- Patent number 10,658,115
- Issue date May 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hye Won Ryoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including embedded capacitor having high diel...
- Patent number 7,351,915
- Issue date Apr 1, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250166903
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...
- Publication number 20240387110
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240290540
- Publication date Aug 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Duk YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240212940
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20230335337
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20230230768
- Publication date Jul 20, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20220189689
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hye Sung Pyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20220172892
- Publication date Jun 2, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MUTILAYER ELECTRONIC COMPONENT
- Publication number 20220093329
- Publication date Mar 24, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20210057153
- Publication date Feb 25, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200357575
- Publication date Nov 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200243263
- Publication date Jul 30, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hye Won Ryoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200168397
- Publication date May 28, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hye Won Ryoo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200152388
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- A Reum Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200152389
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT
- Publication number 20200118759
- Publication date Apr 16, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Gi Seok JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR HAVING DUMMY PATTERN
- Publication number 20200118760
- Publication date Apr 16, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ho In JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20200118749
- Publication date Apr 16, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Sun Cheol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT
- Publication number 20200111612
- Publication date Apr 9, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Gi Seok JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIEL...
- Publication number 20070146980
- Publication date Jun 28, 2007
- Samsung Electro-mechanics Co., Ltd.
- Jin-Yong Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board including embedded capacitor having high diel...
- Publication number 20060044734
- Publication date Mar 2, 2006
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin-Yong Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating PCB including embedded passive chip
- Publication number 20060014327
- Publication date Jan 19, 2006
- Samsung Electro-Mechanics CO., LTD.
- Suk-Hyeon Cho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Multilayer electronic component

Multilayer electronic component

Multilayer electronic component

Multilayer electronic component

Multilayer electronic component

Multilayer electronic component

Multi-layered ceramic electronic component

Multi-layered ceramic electronic component having step absorption l...

Multilayer ceramic electronic component

Capacitor component and method for manufacturing the same

Multilayer ceramic capacitor having dummy pattern

Multilayer ceramic electronic component

Multilayer ceramic electronic component

Multilayer ceramic electronic component

Capacitor component and method for manufacturing the same

Printed circuit board including embedded capacitor having high diel...

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDD...

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MUTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR HAVING DUMMY PATTERN

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIEL...

Printed circuit board including embedded capacitor having high diel...

Method of fabricating PCB including embedded passive chip