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Ho-Yin YIU
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Kowloon, CN
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Patents Grants
last 30 patents
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Patent Grant
Chip package and method for forming the same
Patent number
10,157,875
Issue date
Dec 18, 2018
Xintec Inc.
Ho-Yin Yiu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip package and method for forming the same
Patent number
9,437,478
Issue date
Sep 6, 2016
Xintec Inc.
Yen-Shih Ho
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20150325557
Publication date
Nov 12, 2015
XINTEC INC.
Ho-Yin YIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20140332908
Publication date
Nov 13, 2014
Yen-Shih HO
G06 - COMPUTING CALCULATING COUNTING