Ho-Yin YIU

Person

KLN, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package having chip connected to sensing device with redistrib...
- Patent number 10,056,419
- Issue date Aug 21, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,966,358
- Issue date May 8, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package having chip connected to sensing de...
- Patent number 9,935,148
- Issue date Apr 3, 2018
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module and method for forming the same
- Patent number 9,812,413
- Issue date Nov 7, 2017
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and the method of packaging the same
- Patent number 9,088,206
- Issue date Jul 21, 2015
- Ho-Yin Yiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Capacitive coupler packaging structure
- Patent number 8,791,768
- Issue date Jul 29, 2014
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,643,070
- Issue date Feb 4, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,614,488
- Issue date Dec 24, 2013
- Ying-Nan Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIB...
- Publication number 20180175092
- Publication date Jun 21, 2018
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170018590
- Publication date Jan 19, 2017
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160372445
- Publication date Dec 22, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160233260
- Publication date Aug 11, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND METHOD FOR FORMING THE SAME
- Publication number 20160211233
- Publication date Jul 21, 2016
- XINTEC INC.
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND THE METHOD OF PACKAGING THE SAME
- Publication number 20120194148
- Publication date Aug 2, 2012
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLER PACKAGING STRUCTURE
- Publication number 20120194301
- Publication date Aug 2, 2012
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120146111
- Publication date Jun 14, 2012
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20120146108
- Publication date Jun 14, 2012
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20120146153
- Publication date Jun 14, 2012
- Ying-Nan WEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Chip package having chip connected to sensing device with redistrib...

Chip package

Method for forming chip package having chip connected to sensing de...

Chip module and method for forming the same

Power module and the method of packaging the same

Capacitive coupler packaging structure

Chip package and method for forming the same

Chip package and method for forming the same

Patents Applicationslast 30 patents

CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIB...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP MODULE AND METHOD FOR FORMING THE SAME

POWER MODULE AND THE METHOD OF PACKAGING THE SAME

CAPACITIVE COUPLER PACKAGING STRUCTURE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME