Ho-Young Son

Person

Daegu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,327,779
- Issue date Jun 10, 2025
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrodes, and semiconductor...
- Patent number 12,009,308
- Issue date Jun 11, 2024
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,823,982
- Issue date Nov 21, 2023
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,594,471
- Issue date Feb 28, 2023
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery case, and battery pack and vehicle including the same
- Patent number 10,468,649
- Issue date Nov 5, 2019
- LG Chem, Ltd.
- Seung-Ryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and stacked semiconductor package having the same
- Patent number 10,014,278
- Issue date Jul 3, 2018
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for analyzing interference in time-space dimen...
- Patent number 9,730,087
- Issue date Aug 8, 2017
- Electronics and Telecommunications Research Institute
- Ho Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi chip package and method for manufacturing the same
- Patent number 9,570,370
- Issue date Feb 14, 2017
- SK Hynix Inc.
- Tac Keun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and stacked semiconductor package having the same
- Patent number 9,159,709
- Issue date Oct 13, 2015
- SK Hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 9,040,419
- Issue date May 26, 2015
- SK Hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of analyzing interference between heterogeneous wireless com...
- Patent number 8,909,155
- Issue date Dec 9, 2014
- Electronics and Telecommunications Research Institute
- Ho Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of analyzing interference between data communication terminals
- Patent number 8,848,598
- Issue date Sep 30, 2014
- Electronics and Telecommunications Research Institute
- Ho Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having a contamination preventing layer forme...
- Patent number 8,816,477
- Issue date Aug 26, 2014
- SK Hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and fabricating method thereof
- Patent number 8,669,642
- Issue date Mar 11, 2014
- SK Hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation distance calculation method and apparatus for avoidance o...
- Patent number 8,626,061
- Issue date Jan 7, 2014
- Electronics and Telecommunications Research Institute
- Ho Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with heat dissipation devices
- Patent number 8,310,045
- Issue date Nov 13, 2012
- SK Hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having through-electrodes which are electrica...
- Patent number 8,217,434
- Issue date Jul 10, 2012
- Hynix Semiconductor Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 8,154,135
- Issue date Apr 10, 2012
- Hynix Semiconductor Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for predicting wave propagation characteristic...
- Patent number 7,809,524
- Issue date Oct 5, 2010
- Electronics and Telecommunications Research Institute
- Ho-Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for generating two-dimensional orthogonal variable spreading...
- Patent number 7,535,821
- Issue date May 19, 2009
- Electronics and Telecommunications Research Institute
- Ho-Kyung Son
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
CMOS image sensor module with wafers
- Patent number 7,446,384
- Issue date Nov 4, 2008
- Korea Advanced Institute of Science and Technology
- Kyung-Wook Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming gate electrode in semiconductor device
- Patent number 7,179,707
- Issue date Feb 20, 2007
- Hynix Semiconductor Inc.
- Cha Deok Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing flash memory device
- Patent number 7,037,785
- Issue date May 2, 2006
- Hynix Semiconductor Inc.
- Cha Deok Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide layer in semiconductor device
- Patent number 7,030,036
- Issue date Apr 18, 2006
- Hynix Semiconductor Inc.
- Ho Min Son
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Curable Composition
- Publication number 20250215194
- Publication date Jul 3, 2025
- LG CHEM, LTD.
- Jeong Hyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR...
- Publication number 20240297121
- Publication date Sep 5, 2024
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20240234255
- Publication date Jul 11, 2024
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curable Composition
- Publication number 20240132657
- Publication date Apr 25, 2024
- LG CHEM, LTD.
- Do Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20240071874
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Curable Composition and Two-Component Curable Composition
- Publication number 20230242713
- Publication date Aug 3, 2023
- LG ENERGY SOLUTION, LTD.
- Ho Yeon Son
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20230178456
- Publication date Jun 8, 2023
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR...
- Publication number 20220208682
- Publication date Jun 30, 2022
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20220165643
- Publication date May 26, 2022
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY CASE, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME
- Publication number 20190088914
- Publication date Mar 21, 2019
- LG CHEM, LTD.
- Seung-Ryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20180040588
- Publication date Feb 8, 2018
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20170179078
- Publication date Jun 22, 2017
- SK HYNIX INC.
- Yeon Seung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20160111397
- Publication date Apr 21, 2016
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150340303
- Publication date Nov 26, 2015
- SK HYNIX INC.
- Tac Keun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ANALYZING INTERFERENCE IN TIME-SPACE DIMEN...
- Publication number 20150208261
- Publication date Jul 23, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Kyung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20150091139
- Publication date Apr 2, 2015
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140329386
- Publication date Nov 6, 2014
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140264833
- Publication date Sep 18, 2014
- SK HYNIX INC.
- Ho-Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140264848
- Publication date Sep 18, 2014
- SK HYNIX INC.
- Ho-Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ANALYZING INTERFERENCE BETWEEN HETEROGENEOUS WIRELESS COM...
- Publication number 20130244582
- Publication date Sep 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Kyung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20130161826
- Publication date Jun 27, 2013
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130099360
- Publication date Apr 25, 2013
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF
- Publication number 20120205816
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Analyzing Interference Between Data Communication Terminals
- Publication number 20120163195
- Publication date Jun 28, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Kyung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP, STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME,...
- Publication number 20120112360
- Publication date May 10, 2012
- Hynix Semiconductor Inc.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION DEVICES
- Publication number 20110304036
- Publication date Dec 15, 2011
- Hynix Semiconductor Inc.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION DISTANCE CALCULATION METHOD AND APPARATUS FOR AVOIDANCE O...
- Publication number 20110151771
- Publication date Jun 23, 2011
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Kyung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100276795
- Publication date Nov 4, 2010
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20100258936
- Publication date Oct 14, 2010
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF DETERMINING MODIFICATION OF WIRELESS SERVIC...
- Publication number 20100167654
- Publication date Jul 1, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ho Kyung SON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Ho-Young Son

Person

Patents Grantslast 30 patents

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor chip including through electrodes, and semiconductor...

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor chip including through electrode, and semiconductor p...

Battery case, and battery pack and vehicle including the same

Semiconductor chip and stacked semiconductor package having the same

Method and apparatus for analyzing interference in time-space dimen...

Multi chip package and method for manufacturing the same

Semiconductor chip and stacked semiconductor package having the same

Semiconductor package and method for manufacturing the same

Method of analyzing interference between heterogeneous wireless com...

Method of analyzing interference between data communication terminals

Semiconductor package having a contamination preventing layer forme...

Semiconductor chip and fabricating method thereof

Isolation distance calculation method and apparatus for avoidance o...

Semiconductor package with heat dissipation devices

Semiconductor package having through-electrodes which are electrica...

Stacked semiconductor package

Apparatus and method for predicting wave propagation characteristic...

Method for generating two-dimensional orthogonal variable spreading...

CMOS image sensor module with wafers

Method of forming gate electrode in semiconductor device

Method of manufacturing flash memory device

Method of forming oxide layer in semiconductor device

Patents Applicationslast 30 patents

Curable Composition

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

Curable Composition

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

Curable Composition and Two-Component Curable Composition

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODES, AND SEMICONDUCTOR...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

BATTERY CASE, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

MULTI CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD AND APPARATUS FOR ANALYZING INTERFERENCE IN TIME-SPACE DIMEN...

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD OF ANALYZING INTERFERENCE BETWEEN HETEROGENEOUS WIRELESS COM...

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP AND FABRICATING METHOD THEREOF

Method of Analyzing Interference Between Data Communication Terminals

SEMICONDUCTOR CHIP, STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME,...

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATION DEVICES

ISOLATION DISTANCE CALCULATION METHOD AND APPARATUS FOR AVOIDANCE O...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD OF DETERMINING MODIFICATION OF WIRELESS SERVIC...