Ho-Yung Hwang

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Two-dimension self-aligned scheme with subtractive metal etch
- Patent number 12,327,764
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide and tin carbide materials for semiconductor patterning ap...
- Patent number 12,272,564
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of Ru metal
- Patent number 12,020,908
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dose reduction of patterned metal oxide photoresists
- Patent number 11,994,800
- Issue date May 28, 2024
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned subtractive etch
- Patent number 11,869,807
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Lili Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor approach to DRAM STI active cut patterning
- Patent number 11,638,374
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Tejinder Singh
Information Patent Grant
Dose reduction of patterned metal oxide photoresists
- Patent number 11,550,222
- Issue date Jan 10, 2023
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,508,618
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect for semiconductor device
- Patent number 11,508,617
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning scheme to improve EUV resist and hard mask selectivity
- Patent number 11,437,238
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Nancy Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 11,437,274
- Issue date Sep 6, 2022
- Micromaterials LLC
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor approach to DRAM STI active cut patterning
- Patent number 11,335,690
- Issue date May 17, 2022
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM capacitor module
- Patent number 11,164,938
- Issue date Nov 2, 2021
- Micromaterials LLC
- Uday Mitra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned subtractive interconnect patterning
- Patent number 11,139,205
- Issue date Oct 5, 2021
- Applied Materials, Inc.
- Lei Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,094,589
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor approach to DRAM STI active cut patterning
- Patent number 10,910,381
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,840,138
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a fully self-aligned via
- Patent number 10,699,953
- Issue date Jun 30, 2020
- Micromaterials LLC
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing self-aligned vias
- Patent number 10,600,688
- Issue date Mar 24, 2020
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,593,594
- Issue date Mar 17, 2020
- Micromaterials LLC
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing self-aligned grown via
- Patent number 10,573,555
- Issue date Feb 25, 2020
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing fully self-aligned vias and contacts
- Patent number 10,553,485
- Issue date Feb 4, 2020
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 10,522,404
- Issue date Dec 31, 2019
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask scheme for cut pattern flow with enlarged EPE window
- Patent number 10,510,540
- Issue date Dec 17, 2019
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing self-aligned vias
- Patent number 10,510,602
- Issue date Dec 17, 2019
- Mirocmaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 10,424,507
- Issue date Sep 24, 2019
- Mirocmaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 10,410,921
- Issue date Sep 10, 2019
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...
- Publication number 20250226235
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240142869
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240145245
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME
- Publication number 20240142870
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yung-chen LIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL
- Publication number 20240071773
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Lei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE TUNING, DEPOSITING, AND ETCHING METHODS
- Publication number 20230215735
- Publication date Jul 6, 2023
- Applied Materials, Inc.
- Lei LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTS
- Publication number 20230115004
- Publication date Apr 13, 2023
- Applied Materials, Inc.
- Tejinder SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR TREATING PHOTORESISTS WITH NON-METAL COMPOUNDS
- Publication number 20230095970
- Publication date Mar 30, 2023
- Applied Materials, Inc.
- Zhiyu HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20230045689
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH
- Publication number 20230033038
- Publication date Feb 2, 2023
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF RU METAL
- Publication number 20220392752
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING SCHEME TO IMPROVE EUV RESIST AND HARD MASK SELECTIVITY
- Publication number 20220367186
- Publication date Nov 17, 2022
- Applied Materials, Inc.
- Nancy Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA
- Publication number 20220359289
- Publication date Nov 10, 2022
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicolor Approach To DRAM STI Active Cut Patterning
- Publication number 20220238531
- Publication date Jul 28, 2022
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF BORON FILMS
- Publication number 20220199401
- Publication date Jun 23, 2022
- Applied Materials, Inc.
- Yung-Chen Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...
- Publication number 20220189786
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM Capacitor Module
- Publication number 20220013624
- Publication date Jan 13, 2022
- Micromaterials LLC.
- Uday Mitra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED SUBTRACTIVE ETCH
- Publication number 20210391215
- Publication date Dec 16, 2021
- Applied Materials, Inc.
- Lili Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH
- Publication number 20210343592
- Publication date Nov 4, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicolor Approach To DRAM STI Active Cut Patterning
- Publication number 20210134807
- Publication date May 6, 2021
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20210125864
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Reflector And Methods Of Manufacture And Patterning
- Publication number 20210116799
- Publication date Apr 22, 2021
- Applied Materials, Inc.
- Lei Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Via
- Publication number 20210090952
- Publication date Mar 25, 2021
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTS
- Publication number 20210033974
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Tejinder SINGH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Self-Aligned Subtractive Interconnect Patterning
- Publication number 20210035863
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Lei Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM Capacitor Module
- Publication number 20200312953
- Publication date Oct 1, 2020
- Micromaterials LLC.
- Uday Mitra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIA
- Publication number 20200098633
- Publication date Mar 26, 2020
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicolor Approach To DRAM STI Active Cut Patterning
- Publication number 20200043932
- Publication date Feb 6, 2020
- Applied Materials, Inc.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Scheme To Improve EUV Resist And Hard Mask Selectivity
- Publication number 20200013620
- Publication date Jan 9, 2020
- Applied Materials, Inc.
- Nancy Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Creating A Fully Self-Aligned Via
- Publication number 20190378756
- Publication date Dec 12, 2019
- Micromaterials LLC.
- Amrita B. Mullick
- H01 - BASIC ELECTRIC ELEMENTS

Ho-Yung Hwang

Person

Patents Grantslast 30 patents

Two-dimension self-aligned scheme with subtractive metal etch

Tin oxide and tin carbide materials for semiconductor patterning ap...

Atomic layer etching of Ru metal

Dose reduction of patterned metal oxide photoresists

Fully self-aligned subtractive etch

Multicolor approach to DRAM STI active cut patterning

Dose reduction of patterned metal oxide photoresists

Multicolor self-aligned contact selective etch

Method of forming interconnect for semiconductor device

Patterning scheme to improve EUV resist and hard mask selectivity

Fully self-aligned via

Multicolor approach to DRAM STI active cut patterning

DRAM capacitor module

Self-aligned subtractive interconnect patterning

Multicolor self-aligned contact selective etch

Multicolor approach to DRAM STI active cut patterning

Selectively etched self-aligned via processes

Method for creating a fully self-aligned via

Methods of producing self-aligned vias

Selectively etched self-aligned via processes

Methods of producing self-aligned grown via

Methods of producing fully self-aligned vias and contacts

Fully self-aligned via

Mask scheme for cut pattern flow with enlarged EPE window

Methods of producing self-aligned vias

Fully self-aligned via

Fully self-aligned via

Patents Applicationslast 30 patents

TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ALUMINUM OXIDE CARBON HYBRID HARDMASKS AND METHODS FOR MAKING THE SAME

ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL

ELECTRODE TUNING, DEPOSITING, AND ETCHING METHODS

DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTS

METHODS FOR TREATING PHOTORESISTS WITH NON-METAL COMPOUNDS

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH

ATOMIC LAYER ETCHING OF RU METAL

PATTERNING SCHEME TO IMPROVE EUV RESIST AND HARD MASK SELECTIVITY

FULLY SELF-ALIGNED VIA

Multicolor Approach To DRAM STI Active Cut Patterning

DEPOSITION OF BORON FILMS

TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...

DRAM Capacitor Module

FULLY SELF-ALIGNED SUBTRACTIVE ETCH

MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH

Multicolor Approach To DRAM STI Active Cut Patterning

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

Multilayer Reflector And Methods Of Manufacture And Patterning

Fully Self-Aligned Via

DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTS

Self-Aligned Subtractive Interconnect Patterning

DRAM Capacitor Module

FULLY SELF-ALIGNED VIA

Multicolor Approach To DRAM STI Active Cut Patterning

Patterning Scheme To Improve EUV Resist And Hard Mask Selectivity

Method For Creating A Fully Self-Aligned Via