Hock Guan Tan

Person

Serangoon, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Dock without a power source for digital devices
- Patent number 8,489,214
- Issue date Jul 16, 2013
- Creative Technology Ltd.
- Xiao Xiang Shen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacked die in die BGA package
- Patent number 8,373,277
- Issue date Feb 12, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,799,610
- Issue date Sep 21, 2010
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating microelectronic component assemblies employin...
- Patent number 7,691,680
- Issue date Apr 6, 2010
- Micron Technologies, Inc.
- Chee Peng Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die with a recess in a die BGA package
- Patent number 7,575,953
- Issue date Aug 18, 2009
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die having a recess in a die BGA pa...
- Patent number 7,371,608
- Issue date May 13, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,358,117
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,344,969
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,819
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die in die BGA package
- Patent number 7,332,820
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,309,623
- Issue date Dec 18, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die-in-die BGA package with die having a recess
- Patent number 7,282,390
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked die in die BGA package
- Patent number 7,282,392
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 7,213,447
- Issue date May 8, 2007
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 6,923,045
- Issue date Aug 2, 2005
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for detecting topographical features of microe...
- Patent number 6,779,386
- Issue date Aug 24, 2004
- Micron Technology Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Grant
Device for detecting an end point of electro-plating and method the...
- Patent number 6,533,920
- Issue date Mar 18, 2003
- Hewlett-Packard Company
- Joo Khim Joachim Ng
- G01 - MEASURING TESTING
Information Patent Grant
PC surround sound mixer
- Patent number 6,449,371
- Issue date Sep 10, 2002
- Creative Technology Ltd.
- Hock Guan Tan
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE IN DIE BGA PACKAGE
- Publication number 20130154117
- Publication date Jun 20, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCK WITHOUT A POWER SOURCE FOR DIGITAL DEVICES
- Publication number 20100183170
- Publication date Jul 22, 2010
- Creative Technology Ltd.
- Xiao Xiang Shen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Stacked die in die BGA package
- Publication number 20080136045
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080096316
- Publication date Apr 24, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die in Die BGA Package
- Publication number 20080032449
- Publication date Feb 7, 2008
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292746
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292743
- Publication date Dec 28, 2006
- Micron Technolgoy, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060292745
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20060216864
- Publication date Sep 28, 2006
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20050229684
- Publication date Oct 20, 2005
- Micron Technology, Inc.
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20040253748
- Publication date Dec 16, 2004
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207516
- Publication date Nov 6, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030207515
- Publication date Nov 6, 2003
- Micron Technology, Inc., Boise, ID
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030162325
- Publication date Aug 28, 2003
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die in die BGA package
- Publication number 20030148597
- Publication date Aug 7, 2003
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for detecting topographical features of microe...
- Publication number 20030041656
- Publication date Mar 6, 2003
- Chee Peng Neo
- G01 - MEASURING TESTING
Information Patent Application
Device for detecting an end point of electro-plating and method the...
- Publication number 20020088721
- Publication date Jul 11, 2002
- Joo Khim Joachim NG
- G01 - MEASURING TESTING

Hock Guan Tan

Person

Patents Grantslast 30 patents

Dock without a power source for digital devices

Stacked die in die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Method of fabricating microelectronic component assemblies employin...

Stacked die with a recess in a die BGA package

Method of fabricating a stacked die having a recess in a die BGA pa...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die-in-die BGA package with die having a recess

Method of fabricating a stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Device for detecting an end point of electro-plating and method the...

PC surround sound mixer

Patents Applicationslast 30 patents

STACKED DIE IN DIE BGA PACKAGE

DOCK WITHOUT A POWER SOURCE FOR DIGITAL DEVICES

Stacked die in die BGA package

Stacked Die in Die BGA Package

Stacked Die in Die BGA Package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...

Method and apparatus for detecting topographical features of microe...

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Stacked die in die BGA package

Method and apparatus for detecting topographical features of microe...

Device for detecting an end point of electro-plating and method the...