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Hock Siang Chua
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Johor, MY
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package having a filled conductive cavity
Patent number
10,770,399
Issue date
Sep 8, 2020
Infineon Technologies AG
Chee Yang Ng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
Patent number
9,475,691
Issue date
Oct 25, 2016
Infineon Technologies AG
Kok Yau Chua
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
Semiconductor Package Having a Filled Conductive Cavity
Publication number
20200258842
Publication date
Aug 13, 2020
Chee Yang Ng
H01 - BASIC ELECTRIC ELEMENTS