Hoechul KIM

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 12,224,262
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,990,444
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatus and wafer to wafer bonding method
- Patent number 11,728,197
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jaehyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,721,562
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,594,443
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 11,152,317
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 10,923,452
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240266317
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230335415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING CHAMBER
- Publication number 20230178345
- Publication date Jun 8, 2023
- Kyoungran Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20220068852
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD
- Publication number 20220020624
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Jaehyun PHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210143026
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057263
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057373
- Publication date Feb 25, 2021
- SAMSUNG ELECTRONICS CO,. LTD.
- TAEYEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20200373274
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20200098711
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Hoechul KIM

Person

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing semiconduct...

Method of fabricating a semiconductor device

Substrate bonding apparatus and method of manufacturing semiconduct...

Wafer to wafer bonding apparatus and wafer to wafer bonding method

Substrate bonding apparatus

Substrate bonding apparatus and method of manufacturing semiconduct...

Semiconductor device including interconnection structure including...

Substrate bonding apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF CLEANING CHAMBER

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE BONDING APPARATUS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME