Hogeon Song

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Inspection system and method for inspecting semiconductor package,...
- Patent number 11,257,723
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Do-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module adapted to be inserted into connector of exter...
- Patent number 10,008,488
- Issue date Jun 26, 2018
- Samsung Electronics Co., Inc.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 9,793,165
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Seyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating fan-out wafer level packages and packages fo...
- Patent number 9,202,716
- Issue date Dec 1, 2015
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for semiconductor package having through silic...
- Patent number 8,933,561
- Issue date Jan 13, 2015
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and fabrication methods thereof
- Patent number 8,766,455
- Issue date Jul 1, 2014
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR PACKAGE,...
- Publication number 20200373209
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Do-Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE AND SEMICONDUCTOR MODULE
- Publication number 20170309606
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
- Publication number 20140312505
- Publication date Oct 23, 2014
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING FAN-OUT WAFER LEVEL PACKAGES AND PACKAGES FO...
- Publication number 20130147063
- Publication date Jun 13, 2013
- Samsung Electronics Co., LTD
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20120214302
- Publication date Aug 23, 2012
- SEYOUNG JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Fabrication Methods thereof
- Publication number 20120112359
- Publication date May 10, 2012
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Fabricating The Same
- Publication number 20120091580
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20120049349
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS

Hogeon Song

Person

Patents Grantslast 30 patents

Inspection system and method for inspecting semiconductor package,...

Semiconductor module adapted to be inserted into connector of exter...

Methods of fabricating semiconductor devices

Methods of fabricating fan-out wafer level packages and packages fo...

Semiconductor device for semiconductor package having through silic...

Stacked semiconductor devices and fabrication methods thereof

Patents Applicationslast 30 patents

INSPECTION SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR PACKAGE,...

MODULE SUBSTRATE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF

METHODS OF FABRICATING FAN-OUT WAFER LEVEL PACKAGES AND PACKAGES FO...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Semiconductor Devices and Fabrication Methods thereof

Semiconductor Devices And Methods Of Fabricating The Same

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME