Hojeong Moon

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Daejeon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating a semiconductor package
- Patent number 9,786,644
- Issue date Oct 10, 2017
- Samsung Electronics Co., Ltd.
- Hongbin Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20170162555
- Publication date Jun 8, 2017
- Junglae Jo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHODS OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20160372433
- Publication date Dec 22, 2016
- Hongbin SHI
- H01 - BASIC ELECTRIC ELEMENTS