Hojin Kim

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabricating three-dimensional semiconductor structures
- Patent number 12,193,231
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Soo Doo Chae
Information Patent Grant
Selective etching with fluorine, oxygen and noble gas containing pl...
- Patent number 12,131,914
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief in semiconductor wafers
- Patent number 11,990,425
- Issue date May 21, 2024
- Tokyo Electron Limited
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...
- Publication number 20240145312
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20240147719
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS
- Publication number 20240071746
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Yu-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
- Publication number 20240071984
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Kandabara Tapily
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES
- Publication number 20240071808
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Etching with Fluorine, Oxygen and Noble Gas Containing Pl...
- Publication number 20220199418
- Publication date Jun 23, 2022
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20220115399
- Publication date Apr 14, 2022
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Relief in Semiconductor Wafers
- Publication number 20220102289
- Publication date Mar 31, 2022
- TOKYO ELECTRON LIMITED
- Hojin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fabricating three-dimensional semiconductor structures

Selective etching with fluorine, oxygen and noble gas containing pl...

Stress relief in semiconductor wafers

Patents Applicationslast 30 patents

METHOD OF SURFACE MODIFICATION FOR WAFER BONDING

METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

Selective Etching with Fluorine, Oxygen and Noble Gas Containing Pl...

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

Stress Relief in Semiconductor Wafers