Hojin RYU

Follow

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature sensor placement for heater substrate in fuser
- Patent number 11,846,901
- Issue date Dec 19, 2023
- Hewlett-Packard Development Company, L.P.
- Hojin Ryu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Heat conduction member for preventing fuser heater from overheating
- Patent number 11,815,833
- Issue date Nov 14, 2023
- Hewlett-Packard Development Company, L.P.
- Jaehyeok Jang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
IMPROVED PERFORMANCE FOR DUPLEX PRINTING OF DOCUMENTS
- Publication number 20240419370
- Publication date Dec 19, 2024
- Hewlett-Packard Development Company, L.P.
- Uichoon LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT CONDUCTION MEMBER FOR PREVENTING FUSER HEATER FROM LOCAL OVERH...
- Publication number 20240402635
- Publication date Dec 5, 2024
- Hewlett-Packard Development Company, L.P.
- Sunhyung LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TEMPERATURE SENSOR PLACEMENT FOR HEATER SUBSTRATE IN FUSER
- Publication number 20230097936
- Publication date Mar 30, 2023
- Hewlett-Packard Development Company, L.P.
- Hojin RYU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HEAT CONDUCTION MEMBER FOR PREVENTING FUSER HEATER FROM OVERHEATING
- Publication number 20230087040
- Publication date Mar 23, 2023
- Hewlett-Packard Development Company, L.P.
- Jaehyeok JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR