Hoki Kim

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dies-on-package devices and methods therefor
- Patent number 10,354,976
- Issue date Jul 16, 2019
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with same level WLP components and metho...
- Patent number 9,991,233
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with upper RDL of WLPS and methods therefor
- Patent number 9,991,235
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with multiple levels and methods therefor
- Patent number 9,985,007
- Issue date May 29, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged components and methods therefor
- Patent number 9,972,573
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with WLP components with dual RDLs for s...
- Patent number 9,972,609
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced density assembly having microelectronic packages mounted a...
- Patent number 9,728,524
- Issue date Aug 8, 2017
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
- Publication number 20180040587
- Publication date Feb 8, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface edge pads for vertical mount packages and methods of...
- Publication number 20180040544
- Publication date Feb 8, 2018
- Invensas Corporation
- Rajesh Emeka Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Multiple Levels and Methods Therefor
- Publication number 20180026018
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Packaged Components and Methods Therefor
- Publication number 20180025987
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Same Level WLP Components and Metho...
- Publication number 20180026011
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
- Publication number 20180026016
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies-on-Package Devices and Methods Therefor
- Publication number 20180026017
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with WLP Components with Dual RDLS for S...
- Publication number 20180026019
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multi-surface edge pads for vertical mount packages and methods of...

Dies-on-package devices and methods therefor

Package-on-package devices with same level WLP components and metho...

Package on-package devices with upper RDL of WLPS and methods therefor

Package on-package devices with multiple levels and methods therefor

Wafer-level packaged components and methods therefor

Package-on-package devices with WLP components with dual RDLs for s...

Enhanced density assembly having microelectronic packages mounted a...

Patents Applicationslast 30 patents

Vertical Memory Module Enabled by Fan-Out Redistribution Layer

Multi-surface edge pads for vertical mount packages and methods of...

Package-on-Package Devices with Multiple Levels and Methods Therefor

Wafer-Level Packaged Components and Methods Therefor

Package-on-Package Devices with Same Level WLP Components and Metho...

Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor

Dies-on-Package Devices and Methods Therefor

Package-on-Package Devices with WLP Components with Dual RDLS for S...