Hoko Kanazawa

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 8,029,911
- Issue date Oct 4, 2011
- Hitachi Chemical Company, Ltd.
- Satoyuki Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 7,208,105
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and wiring-connected board production pr...
- Patent number 7,141,645
- Issue date Nov 28, 2006
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and process for producing circuit board...
- Patent number 6,762,249
- Issue date Jul 13, 2004
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...
- Publication number 20100294551
- Publication date Nov 25, 2010
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...
- Publication number 20100265685
- Publication date Oct 21, 2010
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for circuit connection, circuit connection method using th...
- Publication number 20070166549
- Publication date Jul 19, 2007
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20060252843
- Publication date Nov 9, 2006
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20040214979
- Publication date Oct 28, 2004
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for circuit connection , circuit connection method using t...
- Publication number 20030141014
- Publication date Jul 31, 2003
- Nomura Satoyuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hoko Kanazawa

Person

Patents Grantslast 30 patents

Adhesive for circuit connection, circuit connection method using th...

Adhesive for circuit connection, circuit connection method using th...

Wiring-connecting material and wiring-connected board production pr...

Wiring-connecting material and process for producing circuit board...

Patents Applicationslast 30 patents

ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...

Adhesive for circuit connection, circuit connection method using th...

Wiring-connecting material and wiring-connected board production pr...

Wiring-connecting material and wiring-connected board production pr...

Adhesive for circuit connection , circuit connection method using t...