Holger Doepke

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Sinzing, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with polymer-based insulating material and met...
- Patent number 11,804,432
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate and a bonded substrate system
- Patent number 10,600,690
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Georg Meyer-Berg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonded system and a method for adhesively bonding a hygroscopic mat...
- Patent number 10,332,814
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate, a bonded substrate system...
- Patent number 10,056,295
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package having a dielectric layer and an encapsulant
- Patent number 10,043,782
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH POLYMER-BASED INSULATING MATERIAL AND MET...
- Publication number 20220254713
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
An Electronic Device Package
- Publication number 20180350780
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate and a Bonded Substrate System
- Publication number 20180350683
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Package Having a Dielectric Layer and an Encapsulant
- Publication number 20170287880
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MAT...
- Publication number 20160247739
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Claus Von Waechter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
- Publication number 20160218039
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS