Holger J. Koenigsmann

Person

  • Oakwood, OH, US

Patents Grantslast 30 patents

  • Information Patent Grant

    High strength lead-free solder materials

    • Patent number 5,985,212
    • Issue date Nov 16, 1999
    • H-Technologies Group, Incorporated
    • Jennie S. Hwang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR