Holger Lundt

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Burghausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for cutting slices from a workpiece
- Patent number 6,773,333
- Issue date Aug 10, 2004
- Siltronic AG
- Holger Lundt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for nondestructive detection of crystal defects
- Patent number 6,362,487
- Issue date Mar 26, 2002
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Andreas Ehlert
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and device for simultaneously cutting off a multiplicity of...
- Patent number 6,295,977
- Issue date Oct 2, 2001
- Wacker-Chemie GmbH
- Bert Ripper
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process and device for producing a cylindrical single crystal and p...
- Patent number 6,159,284
- Issue date Dec 12, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Hans Olkrug
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for achieving a wear performance which is as linear as possi...
- Patent number 6,129,609
- Issue date Oct 10, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Bert Ripper
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for machining semiconductor material
- Patent number 5,741,173
- Issue date Apr 21, 1998
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Holger Lundt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for cutting slices from a workpiece
- Publication number 20020174861
- Publication date Nov 28, 2002
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Holger Lundt
- B28 - WORKING CEMENT, CLAY, OR STONE