Holger Schuehrer

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Back end of the line metal structure and method
- Patent number 11,127,674
- Issue date Sep 21, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-contacts and related fabricati...
- Patent number 8,951,907
- Issue date Feb 10, 2015
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing contamination by providing an etch stop layer at...
- Patent number 8,426,312
- Issue date Apr 23, 2013
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact optimization for enhancing stress transfer in closely space...
- Patent number 8,384,161
- Issue date Feb 26, 2013
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing semiconductor package tensile stress
- Patent number 8,212,346
- Issue date Jul 3, 2012
- Global Foundries, Inc.
- E. Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void sealing in a dielectric material of a contact level of a semic...
- Patent number 8,129,276
- Issue date Mar 6, 2012
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing metal voids in a metallization layer stack of a semiconduc...
- Patent number 8,097,536
- Issue date Jan 17, 2012
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing contamination of semiconductor substrates during BEOL proc...
- Patent number 8,039,400
- Issue date Oct 18, 2011
- GLOBALFOUNDRIES Inc.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a passivation layer prior to depositing a barri...
- Patent number 7,820,536
- Issue date Oct 26, 2010
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a protection layer at the substrate...
- Patent number 7,781,343
- Issue date Aug 24, 2010
- GLOBALFOUNDRIES Inc.
- Tobias Letz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for determining characteristics of semiconductor all...
- Patent number 7,763,476
- Issue date Jul 27, 2010
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for non-destructive metal delamination monitoring in semi...
- Patent number 7,638,424
- Issue date Dec 29, 2009
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and semiconductor structure for monitoring the fabrication o...
- Patent number 7,491,555
- Issue date Feb 17, 2009
- Advanced Micro Devices, Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing contamination by removing an interlayer dielectr...
- Patent number 7,410,885
- Issue date Aug 12, 2008
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain in different cha...
- Patent number 7,396,718
- Issue date Jul 8, 2008
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming a passivation layer prior to depositing a bar...
- Patent number 7,259,091
- Issue date Aug 21, 2007
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK END OF THE LINE METAL STRUCTURE AND METHOD
- Publication number 20210118796
- Publication date Apr 22, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Dirk Breuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-CONTACTS AND RELATED FABRICATI...
- Publication number 20120146106
- Publication date Jun 14, 2012
- GLOBALFOUNDRIES INC.
- Ralf RICHTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OPTIMIZATION FOR ENHANCING STRESS TRANSFER IN CLOSELY SPACE...
- Publication number 20100327367
- Publication date Dec 30, 2010
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID SEALING IN A DIELECTRIC MATERIAL OF A CONTACT LEVEL OF A SEMIC...
- Publication number 20100193963
- Publication date Aug 5, 2010
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A SEMICONDUC...
- Publication number 20100109161
- Publication date May 6, 2010
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REDUCING SEMICONDUCTOR PACKAGE TENSILE STRESS
- Publication number 20100102435
- Publication date Apr 29, 2010
- Advanced Micro Devices, Inc.
- E. Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES DURING BEOL PROC...
- Publication number 20090325378
- Publication date Dec 31, 2009
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING A PROTECTION LAYER AT THE SUBSTRATE...
- Publication number 20080132072
- Publication date Jun 5, 2008
- Tobias Letz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR DETERMINING CHARACTERISTICS OF SEMICONDUCTOR ALL...
- Publication number 20080012073
- Publication date Jan 17, 2008
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR NON-DESTRUCTIVE METAL DELAMINATION MONITORING IN SEMI...
- Publication number 20070178691
- Publication date Aug 2, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING CONTAMINATION BY PROVIDING AN ETCH STOP LAYER AT...
- Publication number 20070155133
- Publication date Jul 5, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING A PASSIVATION LAYER PRIOR TO DEPOSITING A BARRI...
- Publication number 20070123034
- Publication date May 31, 2007
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SEMICONDUCTOR STRUCTURE FOR MONITORING THE FABRICATION O...
- Publication number 20070048883
- Publication date Mar 1, 2007
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING CONTAMINATION BY REMOVING AN INTERLAYER DIELECTR...
- Publication number 20070026670
- Publication date Feb 1, 2007
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming self-aligned vias in a metallization layer
- Publication number 20060246718
- Publication date Nov 2, 2006
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electrical connections in a semiconductor structure
- Publication number 20060141775
- Publication date Jun 29, 2006
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for creating different mechanical strain in different cha...
- Publication number 20060091471
- Publication date May 4, 2006
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming a passivation layer prior to depositing a bar...
- Publication number 20060024951
- Publication date Feb 2, 2006
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS

Holger Schuehrer

Person

Patents Grantslast 30 patents

Back end of the line metal structure and method

Semiconductor devices having through-contacts and related fabricati...

Method of reducing contamination by providing an etch stop layer at...

Contact optimization for enhancing stress transfer in closely space...

Method and apparatus for reducing semiconductor package tensile stress

Void sealing in a dielectric material of a contact level of a semic...

Reducing metal voids in a metallization layer stack of a semiconduc...

Reducing contamination of semiconductor substrates during BEOL proc...

Method for removing a passivation layer prior to depositing a barri...

Semiconductor substrate having a protection layer at the substrate...

Test structure for determining characteristics of semiconductor all...

Technique for non-destructive metal delamination monitoring in semi...

Method and semiconductor structure for monitoring the fabrication o...

Method of reducing contamination by removing an interlayer dielectr...

Technique for creating different mechanical strain in different cha...

Technique for forming a passivation layer prior to depositing a bar...

Patents Applicationslast 30 patents

BACK END OF THE LINE METAL STRUCTURE AND METHOD

SEMICONDUCTOR DEVICES HAVING THROUGH-CONTACTS AND RELATED FABRICATI...

CONTACT OPTIMIZATION FOR ENHANCING STRESS TRANSFER IN CLOSELY SPACE...

VOID SEALING IN A DIELECTRIC MATERIAL OF A CONTACT LEVEL OF A SEMIC...

REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A SEMICONDUC...

METHOD AND APPARATUS FOR REDUCING SEMICONDUCTOR PACKAGE TENSILE STRESS

REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES DURING BEOL PROC...

SEMICONDUCTOR SUBSTRATE HAVING A PROTECTION LAYER AT THE SUBSTRATE...

TEST STRUCTURE FOR DETERMINING CHARACTERISTICS OF SEMICONDUCTOR ALL...

TECHNIQUE FOR NON-DESTRUCTIVE METAL DELAMINATION MONITORING IN SEMI...

METHOD OF REDUCING CONTAMINATION BY PROVIDING AN ETCH STOP LAYER AT...

METHOD FOR REMOVING A PASSIVATION LAYER PRIOR TO DEPOSITING A BARRI...

METHOD AND SEMICONDUCTOR STRUCTURE FOR MONITORING THE FABRICATION O...

METHOD OF REDUCING CONTAMINATION BY REMOVING AN INTERLAYER DIELECTR...

Technique for forming self-aligned vias in a metallization layer

Method of forming electrical connections in a semiconductor structure

Technique for creating different mechanical strain in different cha...

Technique for forming a passivation layer prior to depositing a bar...