Holger Schuhrer

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of reducing wafer contamination by removing under-metal laye...
- Patent number 7,169,664
- Issue date Jan 30, 2007
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of reducing wafer contamination by removing under-metal laye...
- Publication number 20040251518
- Publication date Dec 16, 2004
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...