Holger Torwesten

Person

Neublberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module comprising transistor chips, diode chips and d...
- Patent number 10,964,642
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules with semiconductor dies bonded to a metal foil
- Patent number 10,192,849
- Issue date Jan 29, 2019
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,553,051
- Issue date Jan 24, 2017
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 9,245,868
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module, method for producing a power semiconduc...
- Patent number 9,214,442
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 8,709,876
- Issue date Apr 29, 2014
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with capacitor and method for the production the...
- Patent number 8,367,514
- Issue date Feb 5, 2013
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 8,264,072
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,263,491
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a nickel-palladium alloy layer
- Patent number 7,755,190
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with capacitor and method for the production the...
- Patent number 7,692,266
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE COMPRISING TRANSISTOR CHIPS, DIODE CHIPS AND D...
- Publication number 20180211917
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20160225717
- Publication date Aug 4, 2016
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil
- Publication number 20150228616
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130005144
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH CAPACITOR AND METHOD FOR THE PRODUCTION THE...
- Publication number 20100129977
- Publication date May 27, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20090102032
- Publication date Apr 23, 2009
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module, Method for Producing a Power Semiconduc...
- Publication number 20080230905
- Publication date Sep 25, 2008
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME
- Publication number 20080217784
- Publication date Sep 11, 2008
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND PRODUCTION METHODS
- Publication number 20080081157
- Publication date Apr 3, 2008
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Electroplating and Contact Projection Arrangement
- Publication number 20070246133
- Publication date Oct 25, 2007
- Johann Helneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnecting element between semiconductor chip and circuit supp...
- Publication number 20070114662
- Publication date May 24, 2007
- Johann Helneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with capacitor and method for the production the...
- Publication number 20060214265
- Publication date Sep 28, 2006
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS

Holger Torwesten

Person

Patents Grantslast 30 patents

Semiconductor module comprising transistor chips, diode chips and d...

Semiconductor modules with semiconductor dies bonded to a metal foil

Electronic component

Method for manufacturing a chip package

Power semiconductor module, method for producing a power semiconduc...

Chip package and method of forming the same

Electronic device

Integrated circuit with capacitor and method for the production the...

Electronic device

Substrate with feedthrough and method for producing the same

Electronic device including a nickel-palladium alloy layer

Integrated circuit with capacitor and method for the production the...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE COMPRISING TRANSISTOR CHIPS, DIODE CHIPS AND D...

ELECTRONIC COMPONENT

Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

CHIP PACKAGE AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICE

INTEGRATED CIRCUIT WITH CAPACITOR AND METHOD FOR THE PRODUCTION THE...

Electronic Device

Power Semiconductor Module, Method for Producing a Power Semiconduc...

SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME

ELECTRONIC DEVICE AND PRODUCTION METHODS

Method for Electroplating and Contact Projection Arrangement

Interconnecting element between semiconductor chip and circuit supp...

Integrated circuit with capacitor and method for the production the...