Holger Woerner

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device stack and method for its production
- Patent number 8,659,135
- Issue date Feb 25, 2014
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
External contact material for external contacts of a semiconductor...
- Patent number 7,893,532
- Issue date Feb 22, 2011
- Infineon Technologies AG
- Michael Bauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with semiconductor chip and rewiring layer and...
- Patent number 7,883,993
- Issue date Feb 8, 2011
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,772,105
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor component and panel used for the production thereof
- Patent number 7,700,956
- Issue date Apr 20, 2010
- Infineon Technologies AG
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device including a housing for a semiconductor chip including leads...
- Patent number 7,692,283
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate of a semiconductor component comprising rubber-ela...
- Patent number 7,638,418
- Issue date Dec 29, 2009
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure with a plastic housing and separable carrie...
- Patent number 7,622,733
- Issue date Nov 24, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card, smart card module, and a method for production of a sma...
- Patent number 7,575,173
- Issue date Aug 18, 2009
- Infineon Technologies, AG
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biosensor with smart card configuration
- Patent number 7,566,968
- Issue date Jul 28, 2009
- Siemens Aktiengesellschaft
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with a wiring substrate and method for produci...
- Patent number 7,545,047
- Issue date Jun 9, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with a thin semiconductor chip and a stiff...
- Patent number 7,528,054
- Issue date May 5, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and a panel
- Patent number 7,524,699
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor component with a media channel
- Patent number 7,516,543
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Holger Woerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for applying rewiring to a panel while compensating for posi...
- Patent number 7,514,273
- Issue date Apr 7, 2009
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing through-contacts and a semiconductor component...
- Patent number 7,482,198
- Issue date Jan 27, 2009
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with a semiconductor stack, and methods for it...
- Patent number 7,456,495
- Issue date Nov 25, 2008
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a recessed bond pad
- Patent number 7,408,241
- Issue date Aug 5, 2008
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module having plug contacts and method for producing it
- Patent number 7,391,103
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,327,023
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a plastic package and method for production
- Patent number 7,276,783
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component with a plastic housi...
- Patent number 7,202,107
- Issue date Apr 10, 2007
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a stack of semiconductor chips and a meth...
- Patent number 7,190,059
- Issue date Mar 13, 2007
- Infineon Technologies AG
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chip and rewiring layer and...
- Patent number 7,091,595
- Issue date Aug 15, 2006
- Infineon Technologies, AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with electromagnetic shielding device
- Patent number 7,009,288
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device configured as a multichip module, leadframe, pane...
- Patent number 6,902,951
- Issue date Jun 7, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING A HOUSING FOR A SEMICONDUCTOR CHIP
- Publication number 20090102044
- Publication date Apr 23, 2009
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Plastic Housing, and Process for Produ...
- Publication number 20080050907
- Publication date Feb 28, 2008
- INFINEON TECHNOLOGIES AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Stack and Method for Its Production
- Publication number 20070278639
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring Substrate of a Semiconductor Component Comprising External C...
- Publication number 20070194459
- Publication date Aug 23, 2007
- Infineon Technologies AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Structure with a Plastic Housing and Separable Carrie...
- Publication number 20070145555
- Publication date Jun 28, 2007
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor component and panel used for the production thereof
- Publication number 20070128754
- Publication date Jun 7, 2007
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device with a wiring substrate and method for produci...
- Publication number 20070126122
- Publication date Jun 7, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing through-contacts and a semiconductor component...
- Publication number 20070099345
- Publication date May 3, 2007
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component with a thin semiconductor chip and a stiff...
- Publication number 20070096305
- Publication date May 3, 2007
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External contact material for external contacts of a semiconductor...
- Publication number 20070057372
- Publication date Mar 15, 2007
- Michael Bauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component with a media channel and method for manufac...
- Publication number 20060278978
- Publication date Dec 14, 2006
- Holger Woerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for encapsulating a semiconductor device and semiconductor d...
- Publication number 20060255435
- Publication date Nov 16, 2006
- Edward Fuergut
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device with semiconductor chip and rewiring layer and...
- Publication number 20060246624
- Publication date Nov 2, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with surface-mountable outer contacts, and pro...
- Publication number 20060192298
- Publication date Aug 31, 2006
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for producing a semiconductor component with a plastic housi...
- Publication number 20060183269
- Publication date Aug 17, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card, smart card module, and a method for production of a sma...
- Publication number 20060175419
- Publication date Aug 10, 2006
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic component and panel for producing the same
- Publication number 20060125042
- Publication date Jun 15, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with plastic housing, and process for produ...
- Publication number 20060076667
- Publication date Apr 13, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biosensor with smart card configuration
- Publication number 20060027905
- Publication date Feb 9, 2006
- Michael Bauer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Electronic device configured as a multichip module, leadframe and p...
- Publication number 20050184375
- Publication date Aug 25, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module with a semiconductor stack, and methods for it...
- Publication number 20050133932
- Publication date Jun 23, 2005
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chip and rewiring layer and...
- Publication number 20050098871
- Publication date May 12, 2005
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module having plug contacts and method for producing it
- Publication number 20050087851
- Publication date Apr 28, 2005
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with electromagnetic shielding device
- Publication number 20050077596
- Publication date Apr 14, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a plastic housing and method for producti...
- Publication number 20040232543
- Publication date Nov 25, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device configured as a multichip module, leadframe, pane...
- Publication number 20040140559
- Publication date Jul 22, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a stack of semiconductor chips and a meth...
- Publication number 20040063304
- Publication date Apr 1, 2004
- Robert-Christian Hagen
- H01 - BASIC ELECTRIC ELEMENTS

Holger Woerner

Person

Patents Grantslast 30 patents

Semiconductor device stack and method for its production

External contact material for external contacts of a semiconductor...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor component with plastic housing, and process for produ...

Sensor component and panel used for the production thereof

Device including a housing for a semiconductor chip including leads...

Wiring substrate of a semiconductor component comprising rubber-ela...

Semiconductor structure with a plastic housing and separable carrie...

Smart card, smart card module, and a method for production of a sma...

Biosensor with smart card configuration

Semiconductor device with a wiring substrate and method for produci...

Semiconductor component with a thin semiconductor chip and a stiff...

Electronic component and a panel

Method for manufacturing semiconductor component with a media channel

Method for applying rewiring to a panel while compensating for posi...

Method for producing through-contacts and a semiconductor component...

Semiconductor module with a semiconductor stack, and methods for it...

Semiconductor device with a recessed bond pad

Electronic module having plug contacts and method for producing it

Semiconductor component with plastic housing, and process for produ...

Electronic component with a plastic package and method for production

Method for producing a semiconductor component with a plastic housi...

Electronic component with a stack of semiconductor chips and a meth...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor component with electromagnetic shielding device

Electronic device configured as a multichip module, leadframe, pane...

Patents Applicationslast 30 patents

DEVICE INCLUDING A HOUSING FOR A SEMICONDUCTOR CHIP

Semiconductor Component with Plastic Housing, and Process for Produ...

Semiconductor Device Stack and Method for Its Production

Wiring Substrate of a Semiconductor Component Comprising External C...

Semiconductor Structure with a Plastic Housing and Separable Carrie...

Sensor component and panel used for the production thereof

Semiconductor device with a wiring substrate and method for produci...

Method for producing through-contacts and a semiconductor component...

Semiconductor component with a thin semiconductor chip and a stiff...

External contact material for external contacts of a semiconductor...

Semiconductor component with a media channel and method for manufac...

Method for encapsulating a semiconductor device and semiconductor d...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor device with surface-mountable outer contacts, and pro...

Method for producing a semiconductor component with a plastic housi...

Smart card, smart card module, and a method for production of a sma...

Electronic component and panel for producing the same

Semiconductor component with plastic housing, and process for produ...

Biosensor with smart card configuration

Electronic device configured as a multichip module, leadframe and p...

Semiconductor module with a semiconductor stack, and methods for it...

Semiconductor device with semiconductor chip and rewiring layer and...

Electronic module having plug contacts and method for producing it

Semiconductor component with electromagnetic shielding device

Electronic component with a plastic housing and method for producti...

Electronic device configured as a multichip module, leadframe, pane...

Electronic component with a stack of semiconductor chips and a meth...